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Title:
CERIUM BASED ABRASIVE MATERIAL AND ABRASIVE MATERIAL SLURRY, AND METHOD FOR PRODUCING CERIUM BASED ABRASIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2002/072726
Kind Code:
A1
Abstract:
A cerium based abrasive material containing cerium oxide as a primary component, characterized in that abrasive material particles constituting the abrasive material are covered with at least one of a silicon component comprising silicon or a silicon compound and an aluminum component comprising aluminum or an aluminum compound; and a method for producing the abrasive material which comprises subjecting a cerium based abrasive material to wet dispersion in a dispersion medium, to prepare a slurry, and adding a treating solution containing at least one of a silicon compound and an aluminum compound to the slurry, to treat the surface of the abrasive material, or which comprises adding a treating solution containing at least one of a silicon compound and an aluminum compound to a slurry during or after a pulverization step of a conventional process for producing a cerium based abrasive material, to treat the surface of the conventional abrasive material, followed by roasting and then classifying.

Inventors:
ITO TERUNORI (JP)
MOCHIZUKI NAOYOSHI (JP)
USHIYAMA KAZUYA (JP)
WATANABE HIROYUKI (JP)
Application Number:
PCT/JP2002/002170
Publication Date:
September 19, 2002
Filing Date:
March 08, 2002
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
ITO TERUNORI (JP)
MOCHIZUKI NAOYOSHI (JP)
USHIYAMA KAZUYA (JP)
WATANABE HIROYUKI (JP)
International Classes:
B24B37/00; C09C1/68; C09G1/02; C09K3/14; H01L21/304; (IPC1-7): C09K3/14; B24B57/02; H01L21/304
Domestic Patent References:
WO2000008678A12000-02-17
Foreign References:
US5766279A1998-06-16
EP0874036A11998-10-28
JP2000265160A2000-09-26
JP2001284296A2001-10-12
Other References:
See also references of EP 1380627A4
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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