Title:
CERIUM OXIDE PARTICLES, CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION COMPRISING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/045856
Kind Code:
A1
Abstract:
Provided are cerium oxide particles for chemical mechanical polishing and a chemical mechanical polishing slurry composition comprising same. Ce3+ and Ce4+ are included on the surfaces of the cerium oxide particles, and when the cerium oxide particles according to an embodiment of the present invention are used, a high oxide film removal rate and high oxide film polishing selectivity can be exhibited in the low content range despite the fine particle size, by increasing the ratio of Ce3+ on the cerium oxide surface.
Inventors:
LEE JEONG HO (KR)
KIM SEOK JOO (KR)
KIM SEOK JOO (KR)
Application Number:
PCT/KR2021/011621
Publication Date:
March 03, 2022
Filing Date:
August 30, 2021
Export Citation:
Assignee:
SOULBRAIN CO LTD (KR)
International Classes:
C09G1/02; C09K3/14; H01L21/306; H01L21/3105
Domestic Patent References:
| WO2019182061A1 | 2019-09-26 |
Foreign References:
| KR20080045326A | 2008-05-23 | |||
| KR101184734B1 | 2012-09-20 | |||
| KR20120081196A | 2012-07-18 | |||
| US6372003B1 | 2002-04-16 |
Attorney, Agent or Firm:
JIDAM IP LAW FIRM (KR)
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