Title:
CHAIN-EXTENDER FOR SELECTIVE IONIC BONDING FOR ENHANCING RHEOLOGICAL PROPERTIES OF EXPANDABLE BIODEGRADABLE RESIN
Document Type and Number:
WIPO Patent Application WO/2020/101106
Kind Code:
A1
Abstract:
The present invention relates to a chain extender for ionic bonding, consisting of a copolymer comprising: (A) a monomer having an ionic functional group exhibiting an opposite polarity of an ionic functional group at a terminal of a thermoplastic resin; and (B) a monomer having a functional group compatible with an uncharged non-terminal region in the thermoplastic resin. The chain extender for ionic bonding of the present invention may change the rheological properties of the thermoplastic resin by forming an ionic bond with the thermoplastic resin, wherein the original properties of the thermoplastic resin can be restored by dissociation of said ionic bond. Accordingly, the chain extender of the present invention may be suitably used for cases in which molding of a thermoplastic resin is needed, wherein the original properties are needed after the molding.
Inventors:
LEE JUN-YOUNG (KR)
HWANG KI SEOB (KR)
JU SUNG HWAN (KR)
CHOI WON JUN (KR)
HWANG KI SEOB (KR)
JU SUNG HWAN (KR)
CHOI WON JUN (KR)
Application Number:
PCT/KR2018/015270
Publication Date:
May 22, 2020
Filing Date:
December 04, 2018
Export Citation:
Assignee:
KOREA INST IND TECH (KR)
International Classes:
C08F2/38; C08F220/34; C08J3/22; C08J9/18
Foreign References:
| US20100311849A1 | 2010-12-09 | |||
| US20150232729A1 | 2015-08-20 | |||
| KR20090126804A | 2009-12-09 | |||
| KR20080032357A | 2008-04-15 |
Other References:
HUANG, Q. R.: "Structure and Interaction of Organic/Inorganic Hybrid Nanocomposites for Microelectronic Applications. 1. MSSQ/P(MMA-co-DMAEMA) Nanocomposites", CHEMISTRY OF MATERIALS, 2002, pages 3676 - 3685, XP002608665, DOI: 10.1021/cm020014z
Attorney, Agent or Firm:
SON, Min (KR)
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