Title:
CHAMBER ENVIRONMENT RECOVERY METHOD AND ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/109670
Kind Code:
A1
Abstract:
Provided is a chamber environment recovery method, comprising: an oxidation step, involving: carrying out an oxidation treatment on particles in a chamber, and extracting an oxidative product in the chamber after a pre-determined time; and a protective film formation step, involving: forming a protective film on an inner wall of the chamber. Further provided is an etching method. By means of the chamber environment recovery method and the etching method, particle contamination can be resolved, and the production capacity and etching rate of a subsequent etching process can also be ensured.
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Inventors:
XU KUI (CN)
HOU JUE (CN)
CHEN PENG (CN)
HOU JUE (CN)
CHEN PENG (CN)
Application Number:
PCT/CN2018/101517
Publication Date:
June 13, 2019
Filing Date:
August 21, 2018
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01J37/32; H01L21/00
Foreign References:
| CN101154559A | 2008-04-02 | |||
| US7176140B1 | 2007-02-13 | |||
| JP2003178993A | 2003-06-27 | |||
| CN105448634A | 2016-03-30 | |||
| CN104282518A | 2015-01-14 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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