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Patent Searching and Data


Title:
CHEMICAL-MECHANICAL POLISHING COMPOSITION, RINSE COMPOSITION, CHEMICAL-MECHANICAL POLISHING METHOD, AND RINSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255862
Kind Code:
A1
Abstract:
Provided are: a chemical-mechanical polishing composition containing an aqueous carrier and at least one compound selected from the group consisting of an abrasive, a basic component, a quaternary polyammonium salt, a quaternary ammonium salt having 6 or more carbon atoms, and an alkylated polymer having an amide structure; a rinse composition containing said at least one compound and an aqueous carrier; and a chemical-mechanical polishing method and a rinsing method which are for a substrate and use the compositions.

Inventors:
KITAMURA HIROSHI (JP)
MASUDA TSUYOSHI (JP)
MATSUMURA YOSHIYUKI (JP)
NAMIKI AKIHISA (JP)
SAITO TAKESHI (JP)
Application Number:
JP2020/023089
Publication Date:
December 24, 2020
Filing Date:
June 11, 2020
Export Citation:
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Assignee:
NIHON CABOT MICROELECTRONICS K K (JP)
International Classes:
B24B55/06; B24B37/00; C09G1/02; C09K3/14; H01L21/304
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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