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Title:
CHEMICAL MECHANICAL POLISHING HEAD HAVING FLOATING WAFER RETAINING RING AND WAFER CARRIER WITH MULTI-ZONE POLISHING PRESSURE CONTROL
Document Type and Number:
WIPO Patent Application WO2000054933
Kind Code:
A3
Abstract:
In one aspect the invention provides a polishing apparatus (101) including a housing (120) a carrier (160) for mounting a substrate (113) to be polished, a retaining ring (134) circumscribing the carrier (113) for retaining the substrate (113), a first coupling (162) attaching the retaining ring (134) to the carrier (160) such that the retaining ring (134) may move relative to the carrier (160), a second coupling (145) attaching the carrier (160) to the housing (120) the housing (120) and the first coupling (162) defining a first pressure chamber (131) to exert a pressure force against the retaining ring (134), and the housing (120) and the second coupling (145) defining a second pressure chamber (132) to exert a pressure force against the subcarrier (160). In one embodiment, the couplings are diaphragms. In another embodiment, the invention includes a single- or multiple-chambered wafer carrier or subcarrier capable of modifying a differential polishing pressure across the surface of the wafer or other substrate.

Inventors:
WANG HUEY-MING
MOLONEY GERARD S
CHIN SCOTT
GERAGHTY JOHN J
DYSON WILLIAM JR
DICKEY TANLIN K
Application Number:
IB0000508W
Publication Date:
January 25, 2001
Filing Date:
February 24, 2000
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORPORATION
International Classes:
B24B37/30; B24B37/32; B24B41/06; B24B49/16; H01L21/304; (IPC1-7): B24B37/04; B24B41/06; B24B53/007
Foreign References:
EP0881039A21998-12-02
EP0548846A11993-06-30
US5584751A1996-12-17
GB2307342A1997-05-21
EP0791431A11997-08-27
GB2315694A1998-02-11
US5857899A1999-01-12
US5651724A1997-07-29
US4918869A1990-04-24
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