CHEMICAL MECHANICAL POLISHING LIQUID AND APPLICATION THEREOF

Title:

CHEMICAL MECHANICAL POLISHING LIQUID AND APPLICATION THEREOF

Document Type and Number:

WIPO Patent Application WO/2016/107409

Kind Code:

A1

Abstract:

The polishing liquid of the present invention provides for polishing of silicon dioxide at very high speed. By means of the synergistic effect of a silicon-containing organic compound and an amphoteric surfactant, high grinding speeds are achieved for a chemical mechanical polishing liquid and the stability problem of polishing liquids is resolved.

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Inventors:

GAO YUAN (CN)
JING JIANFEN (CN)
YAO YING (CN)
SONG KAI (CN)
CAI XINYUAN (CN)
PAN YIJUN (CN)

Application Number:

PCT/CN2015/097557

Publication Date:

July 07, 2016

Filing Date:

December 16, 2015

Export Citation:

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Assignee:

GAO YUAN (CN)
JING JIANFEN (CN)
YAO YING (CN)
SONG KAI (CN)
CAI XINYUAN (CN)
PAN YIJUN (CN)

International Classes:

C09G1/02

Foreign References:

CN101338082A	2009-01-07
CN1809620A	2006-07-26
US20070075292A1	2007-04-05

Attorney, Agent or Firm:

HANHONG LAW FIRM (CN)
上海翰鸿律师事务所 (CN)

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