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Title:
A CHEMICAL-MECHANICAL POLISHING LIQUID FOR POLISHING POLYSILICON
Document Type and Number:
WIPO Patent Application WO/2008/040158
Kind Code:
A1
Abstract:
A chemical-mechanical polishing liquid for polishing polysilicon is disclosed, which comprises abrasive particles and water, and further comprises one or more kind of oxidizing agent. Under basic condition, the polishing liquid may significantly change removal rate of polysilicon, adjust selectivity ratio of polysilicon and SiO2, and obviously improve the planarization-efficiency of polysilicon and removal of polishing residues.

Inventors:
JING, Judy, Jianfen (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
荆建芬 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
Application Number:
CN2007/002716
Publication Date:
April 10, 2008
Filing Date:
September 14, 2007
Export Citation:
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Assignee:
ANJI MICROELECTRONICS (SHANGHAI) CO., LTD. (Suite 613-618, Building #5No. 3000 Longdong Ave.,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
安集微电子(上海)有限公司 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
JING, Judy, Jianfen (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
International Classes:
C09G1/02; C09G1/00
Attorney, Agent or Firm:
ZHENGHAN LAW FIRM (18th Floor, South Tower of Shanghai Stock Exchange BuildingN° 528 Pu Dong Road, Shanghai 0, 200120, CN)
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