Title:
CHEMICAL-MECHANICAL POLISHING MACHINE
Document Type and Number:
WIPO Patent Application WO/2017/118361
Kind Code:
A1
Abstract:
A chemical-mechanical polishing machine (100) is provided, including: a plurality of polishers (10) spaced apart from one another, each polisher (10) including: a bracket (11), a polishing head (12) and a platen (13), the polishing head (12) being disposed on the bracket (11) and configured to move between a polishing position and a conveying position, in which when the polishing head (12) is located at the polishing position, the polishing head (12) is located above the platen (13); and a conveying assembly (20), the conveying assembly (20) including: a rotating plate (21) and a plurality of loading and unloading tables (22), the plurality of loading and unloading tables (22) being spaced apart from one another, disposed on the rotating plate (21) and configured to rotate along with the rotating plate (21), in which when the polishing head (12) is located at the conveying position, the polishing head (12) is corresponding to one of the plurality of loading and unloading tables (22).
Inventors:
XU ZHENJIE (CN)
WANG JIAN (CN)
CHEN XIANGYU (CN)
WANG TONGQING (CN)
LI KUN (CN)
LU XINCHUN (CN)
WANG JIAN (CN)
CHEN XIANGYU (CN)
WANG TONGQING (CN)
LI KUN (CN)
LU XINCHUN (CN)
Application Number:
PCT/CN2017/000070
Publication Date:
July 13, 2017
Filing Date:
January 03, 2017
Export Citation:
Assignee:
HWATSING TECH CO LTD (CN)
UNIV TSINGHUA (CN)
UNIV TSINGHUA (CN)
International Classes:
B24B37/27; B24B37/04
Foreign References:
| CN105598827A | 2016-05-25 | |||
| CN102211311A | 2011-10-12 | |||
| CN101277787A | 2008-10-01 | |||
| CN101934496A | 2011-01-05 | |||
| CN203197693U | 2013-09-18 | |||
| JP2001162505A | 2001-06-19 |
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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