Title:
CHEMICAL-MECHANICAL POLISHING OF METALS IN AN OXIDIZED FORM
Document Type and Number:
WIPO Patent Application WO2005068572
Kind Code:
A3
Abstract:
The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanical polishing system comprising: (i) a polishing component, (ii) a reducing agent, and (iii) a liquid carrier, and (c) abrading at least a portion of the metal in an oxidized form to polish the substrate. The reducing agent can be selected from the group consisting of 3-hydroxy-4-pyrones, a-hydroxy-?-butyrolactones, ascorbic acid, borane, borohydrides, dialkylamine boranes, formaldehyde, formic acid, hydrogen, hydroquinones, hydroxylamine, hypophosphorous acid, phosphorous acid, a metal or metal ions in an oxidation state having a standard redox potential that is less than the standard redox potential of the metal in an oxidized form, trihydroxybenzenes, solvated electrons, sulfurous acid, salts thereof, and mixtures thereof.
Inventors:
DE REGE THESAURO FRANCESCO (US)
BRUSIC VLASTA (US)
BAYER BENJAMIN P (US)
BRUSIC VLASTA (US)
BAYER BENJAMIN P (US)
Application Number:
PCT/US2005/000140
Publication Date:
February 02, 2006
Filing Date:
January 05, 2005
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
C09G1/02; H01L21/321; H01L21/768; (IPC1-7): C09G1/02; H01L21/321; H01L21/768
Domestic Patent References:
| WO2000077107A1 | 2000-12-21 |
Foreign References:
| US20020042208A1 | 2002-04-11 | |||
| EP1006166A1 | 2000-06-07 |
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