Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHEMICAL-MECHANICAL POLISHING METHOD AND POLISHING DEVICE FOR INTEGRAL IMPELLER
Document Type and Number:
WIPO Patent Application WO/2020/258244
Kind Code:
A1
Abstract:
A chemical-mechanical polishing device for an integral impeller. The device comprises an electric motor (1), a bolt (2), a coupling (9), a mounting plate (3), a positioning support plate (4), a connection piece (10), a base (5), a container (7) and a plastic foam (6), wherein the electric motor (1) is mounted on the base (5) by means of the mounting plate (3) and the positioning support plate (4), and a rotary shaft of the electric motor (1) is connected to an integral impeller (11) by means of the coupling (9) and the connection piece (10). The polishing device is simple in structure, easy to manufacture, convenient to operate, stable and reliable, and low in cost. Further provided is a chemical-mechanical polishing method for an integral impeller, in which method chemical reagents and abrasives are mixed to form a polishing liquid; the whole of the integral impeller is immersed in the polishing liquid and is driven by the electric motor to rotate; under the combined action of chemical corrosion softening of the polishing liquid and mechanical scraping removal, precise polishing of various parts of an integral impeller surface is carried out. The polishing method has strong versatility, high polishing efficiency, and good polishing quality.

Inventors:
ZHANG ZHENYU (CN)
LIAO LONGXING (CN)
MENG FANNING (CN)
MENG XIANGDONG (CN)
Application Number:
CN2019/093669
Publication Date:
December 30, 2020
Filing Date:
June 28, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UNIV DALIAN TECH (CN)
International Classes:
B24B31/02; C09G1/02
Domestic Patent References:
WO2010023226A12010-03-04
Foreign References:
CN106826529A2017-06-13
CN105650024A2016-06-08
CN101092552A2007-12-26
JP2002046056A2002-02-12
CN103894933A2014-07-02
Download PDF: