Title:
CHEMICAL-MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO2001041973
Kind Code:
A3
Abstract:
The present invention provides a method for chemically-mechanically polishing a substrate comprising tantalum and a conductive metal (other than tantalum). The method comprises (a) applying to the substrate a conductive metal-selective polishing composition and a metal oxide abrasive, (b) selectively removing at least a portion of the conductive metal as compared to the tantalum from the substrate, (c) applying to the substrate a tantalum-selective polishing composition and a metal oxide abrasive, and (d) removing at least a portion of the tantalum as compared to the conductive metal from the substrate. In one embodiment, the conductive metal-selective polishing composition is any such polishing composition, and the tantalum-selective polishing composition comprises a persulfate compound and a passivation film-forming agent for the conductive metal. In another embodiment, the conductive metal-selective polishing composition comprises a persulfate compound and optionally a passivation film-forming agent for the conductive metal, and the conductive metal-selective polishing composition or the polishing process is adjusted to render the conductive metal-selective polishing composition a tantalum-selective polishing composition, such as described above.
Inventors:
WANG SHUMIN
CHOU HOMER
CHOU HOMER
Application Number:
PCT/US2000/042522
Publication Date:
January 03, 2002
Filing Date:
December 01, 2000
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
B24B37/00; C09G1/02; B24B57/02; C09K3/14; H01L21/304; H01L21/3105; H01L21/3205; H01L21/321; (IPC1-7): H01L21/321; C09G1/02
Domestic Patent References:
| WO2000000567A1 | 2000-01-06 | |||
| WO2000000561A1 | 2000-01-06 | |||
| WO2000035627A2 | 2000-06-22 |
Foreign References:
| EP0811665A2 | 1997-12-10 | |||
| US5516346A | 1996-05-14 |
Other References:
WIJEKOON K ET AL: "DEVELOPMENT OF A PRODUCTION WORTHY COPPER CMP PROCESS", 1998 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP. ASMC'98. SEMICONDUCTOR MANUFACTURING: MEETING THE CHALLENGES OF THE GLOBAL MARKETPLACE. BOSTON, MA, SEPT. 23 - 25, 1998, IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFE, vol. CONF. 9, 23 September 1998 (1998-09-23), pages 354 - 363, XP000850447, ISBN: 0-7803-4381-6
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