Title:
CHEMICAL MECHANICAL POLISHING OPERATION PLATFORM AND CHEMICAL MECHANICAL POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/143262
Kind Code:
A1
Abstract:
A chemical mechanical polishing operation platform and a chemical mechanical polishing apparatus comprising a polishing head support (1). The polishing head support (1) comprises multiple branch supports (111). The multiple branch supports (111) are distributed around a pre-configured center (4). A sliding rail (112) extending towards the pre-configured center (4) is provided on each branch support (111). The sliding rail (112) is configured to slidably connect a polishing head movable module (51) to the branch support (111). Each operation platform (2) corresponds to one branch support (111), and is located below each corresponding branch support (111). The chemical mechanical polishing operation platform further comprises multiple partition plates (3) respectively provided between two adjacent branch supports (111) of the multiple branch supports (111). The partition plates (3) are vertically provided, extend towards the pre-configured center (4), and shield two adjacent operation platforms (2) from each other. On the chemical mechanical polishing operation platform and the chemical mechanical polishing apparatus, each polishing head module (52) corresponds to one operation platform (2), thereby preventing the polishing head modules from interfering with and contaminating each other. The polishing head module (52) can move easily on the sliding rail (112), and the invention is easy to operate. The chemical mechanical polishing apparatus employing the chemical mechanical polishing operation platform improves the quality of polishing.
Inventors:
YIN YING (CN)
LI TING (CN)
LIU FUQIANG (CN)
BAI KUN (CN)
FEI JIUHAI (CN)
LI TING (CN)
LIU FUQIANG (CN)
BAI KUN (CN)
FEI JIUHAI (CN)
Application Number:
PCT/CN2019/111089
Publication Date:
July 16, 2020
Filing Date:
October 14, 2019
Export Citation:
Assignee:
BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE THE 45TH RES INSTITUTE OF CETC (CN)
International Classes:
B24B37/00
Foreign References:
| CN109500724A | 2019-03-22 | |||
| CN102240927A | 2011-11-16 | |||
| CN205386645U | 2016-07-20 | |||
| CN201833275U | 2011-05-18 | |||
| CN204382014U | 2015-06-10 | |||
| JP2011101913A | 2011-05-26 | |||
| US20080146119A1 | 2008-06-19 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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