Title:
CHEMICAL MECHANICAL POLISHING PAD HAVING PATTERN STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/242172
Kind Code:
A1
Abstract:
The present invention relates to a chemical mechanical polishing pad having a pattern structure and, more specifically, to a chemical mechanical polishing pad having a pattern structure for allowing the polishing pad to have uniform polishing performance. The present invention provides a chemical mechanical polishing pad having a pattern structure, the chemical mechanical polishing pad comprising: a polishing pad provided to polish a wafer placed thereon; and a plurality of figure units formed on the polishing pad and protruding upward from the polishing pad, wherein each of the figure units is formed to have an apparent contact area and a circumferential length per unit area which correspond to target polishing characteristics.
Inventors:
KIM HYOUNG JAE (KR)
KIM DO YEON (KR)
LEE TAE KYUNG (KR)
KANG PIL SIK (KR)
KIM DO YEON (KR)
LEE TAE KYUNG (KR)
KANG PIL SIK (KR)
Application Number:
PCT/KR2020/006781
Publication Date:
December 03, 2020
Filing Date:
May 26, 2020
Export Citation:
Assignee:
KOREA INST IND TECH (KR)
International Classes:
B24B37/26; B24B37/22; H01L21/67
Foreign References:
| KR20030068576A | 2003-08-21 | |||
| KR20080038607A | 2008-05-07 | |||
| KR101735567B1 | 2017-05-15 | |||
| JP2001150332A | 2001-06-05 | |||
| JP2008012650A | 2008-01-24 | |||
| JP2005183712A | 2005-07-07 | |||
| KR20010036591A | 2001-05-07 | |||
| KR20180091284A | 2018-08-16 |
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
Download PDF: