Title:
CHEMICAL-MECHANICAL POLISHING PAD AND CHEMICAL-MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/008252
Kind Code:
A1
Abstract:
Disclosed is a chemical-mechanical polishing pad provided with a polishing layer, wherein recesses are disposed on the surface of the polishing layer for polishing. The polishing layer: has a surface layer section that contains at least the inner surfaces of the recesses; and is characterized in that the ratio (D1/D2) of the average opening ratio (D1) (%) in the inner surfaces of the recesses when the polishing layer is immersed in 23°C water for one hour to the average opening ratio (D2) (%) in a cross section when the cross section, defined by cutting the polishing layer in a plane that does not intersect with the surface layer section, is immersed in 23°C water for one hour is 0.01 to 0.5.
Inventors:
KUBO, Kotaro (9-2 Higashi-shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
久保 光太郎 (〒40 東京都港区東新橋一丁目９番２号 ＪＳＲ株式会社内 Tokyo, 〒1058640, JP)
HOSAKA, Yukio (9-2 Higashi-shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
久保 光太郎 (〒40 東京都港区東新橋一丁目９番２号 ＪＳＲ株式会社内 Tokyo, 〒1058640, JP)
HOSAKA, Yukio (9-2 Higashi-shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
Application Number:
JP2011/063500
Publication Date:
January 19, 2012
Filing Date:
June 13, 2011
Export Citation:
Assignee:
JSR CORPORATION (9-2 Higashi-shinbashi 1-chome, Minato-ku Tokyo, 40, 〒1058640, JP)
ＪＳＲ株式会社 (〒40 東京都港区東新橋一丁目９番２号 Tokyo, 〒1058640, JP)
KUBO, Kotaro (9-2 Higashi-shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
久保 光太郎 (〒40 東京都港区東新橋一丁目９番２号 ＪＳＲ株式会社内 Tokyo, 〒1058640, JP)
ＪＳＲ株式会社 (〒40 東京都港区東新橋一丁目９番２号 Tokyo, 〒1058640, JP)
KUBO, Kotaro (9-2 Higashi-shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
久保 光太郎 (〒40 東京都港区東新橋一丁目９番２号 ＪＳＲ株式会社内 Tokyo, 〒1058640, JP)
International Classes:
H01L21/304; B24B37/00
Attorney, Agent or Firm:
OFUCHI, Michie et al. (2nd Floor, Ogikubo TM Bldg.,26-13, Ogikubo 5-chome,,Suginami-k, Tokyo 51, 〒1670051, JP)
Claims: