Title:
CHEMICAL MECHANICAL POLISHING RETAINING RING
Document Type and Number:
WIPO Patent Application WO2005092010
Kind Code:
A3
Abstract:
In one embodiment (1), the disclosure is directed to a chemical mechanical polishing retaining ring (106). The chemical mechanical polishing retaining ring (106) includes a support formed of a first material (114) comprising a first polymer and a wear portion formed of a second material (116) comprising a second polymer. The first material (114) has an elastic modulus greater than the elastic modulus of the second material (116).
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Inventors:
WILKINSON DAVID (US)
HAMILTON COLLEEN E (US)
HIRSCHORN BRYAN D (US)
MANGAUDIS MICHAEL JOHN (US)
HAMILTON COLLEEN E (US)
HIRSCHORN BRYAN D (US)
MANGAUDIS MICHAEL JOHN (US)
Application Number:
PCT/US2005/009195
Publication Date:
May 11, 2006
Filing Date:
March 18, 2005
Export Citation:
Assignee:
SAINT GOBAIN PERFORMANCE PLAST (US)
International Classes:
B24B1/00; B23H5/08; B24B37/04; B24B41/06
Foreign References:
| US6602114B1 | 2003-08-05 | |||
| US6390904B1 | 2002-05-21 | |||
| US6758939B2 | 2004-07-06 | |||
| US6899610B2 | 2005-05-31 |
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