Title:
CHEMICAL MECHANICAL POLISHING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2019/129107
Kind Code:
A1
Abstract:
Disclosed is a chemical mechanical polishing solution. The polishing solution comprises abrasive particles, a water-soluble polymer, and a nonionic surfactant; the nonionic surfactant is polyvinylpyrrolidone. The polishing solution of the present invention has excellent stability, and can significantly change a polysilicon removal rate under alkaline conditions, thereby achieving adjustment to a selection ratio of polysilicon to silicon oxide and improving the polysilicon planarization efficiency.
Inventors:
PAN YIJUN (CN)
JIN JIANFEN (CN)
ZHANG JIAN (CN)
YAO YING (CN)
SONG KAI (CN)
CAI XINYUAN (CN)
YANG JUNYA (CN)
BIAN PENGCHENG (CN)
LI HENG (CN)
JIN JIANFEN (CN)
ZHANG JIAN (CN)
YAO YING (CN)
SONG KAI (CN)
CAI XINYUAN (CN)
YANG JUNYA (CN)
BIAN PENGCHENG (CN)
LI HENG (CN)
Application Number:
PCT/CN2018/124057
Publication Date:
July 04, 2019
Filing Date:
December 26, 2018
Export Citation:
Assignee:
ANJI MICROELECTRONICS SHANGHAI CO LTD (CN)
International Classes:
C09G1/02; H01L21/304
Foreign References:
| CN1714432A | 2005-12-28 | |||
| CN101636465A | 2010-01-27 | |||
| CN101457126A | 2009-06-17 | |||
| CN102101976A | 2011-06-22 | |||
| CN101358109A | 2009-02-04 | |||
| CN101451046A | 2009-06-10 | |||
| CN103131330A | 2013-06-05 |
Attorney, Agent or Firm:
BEIJING DACHENG LAW OFFICES, LLP (CN)
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