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Title:
CHEMICAL AND PHYSICAL PROCESSING DEVICE AND CHEMICAL AND PHYSICAL PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/122586
Kind Code:
A1
Abstract:
The time needed for mixing and delays that occur in heat regulation, which influences chemical and physical processing, are fundamental issues in chemical and physical processing methods. As a result of said issues, side reactions and the like progress and process yield declines. The disclosed chemical and physical processing device is characterised by the introduction of an object to be treated into a gap formed by a rotating body and a separate body that faces the rotating body and the conduction of physicochemical processing on the basis of the rotation of the rotating body. Provided is: a chemical and physical processing device, which is characterised by the combining of at least one flow of the object to be treated, which opposes the centrifugal force, and at least one flow of the object to be treated, which conforms to the centrifugal force; and a chemical and physical process that uses said device. An additional characteristic is that a chemical and physical processing device, which uses at least one flow of an object to be treated that opposes the centrifugal force, and a chemical and physical process, which uses said device, are provided. The disclosed device is ideal in fields such as flow-parallel compound processes, DDS drugs, micro-encapsulation and self-organisation.

Inventors:
TOMA Hitoshi (2-11-10, Nakatahigashi Izumi-ku, Yokohama-sh, Kanagawa 13, 〒2450013, JP)
當麻均 (〒13 神奈川県横浜市泉区中田東2-11-10 Kanagawa, 〒2450013, JP)
NISHINO Koichi (79-1. Tokiwadai, Hodogaya-ku Yokohama-sh, Kanagawa 01, 〒2408501, JP)
西野 耕一 (〒01 神奈川県横浜市保土ケ谷区常盤台79-1 Kanagawa, 〒2408501, JP)
ISHIDA Akinobu (79-1. Tokiwadai, Hodogaya-ku Yokohama-sh, Kanagawa 01, 〒2408501, JP)
Application Number:
JP2011/057710
Publication Date:
October 06, 2011
Filing Date:
March 28, 2011
Export Citation:
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Assignee:
TOMA Hitoshi (2-11-10, Nakatahigashi Izumi-ku, Yokohama-sh, Kanagawa 13, 〒2450013, JP)
當麻均 (〒13 神奈川県横浜市泉区中田東2-11-10 Kanagawa, 〒2450013, JP)
YOKOHAMA National University (79-1, Tokiwadai Hodogaya-ku, Yokohama-sh, Kanagawa 01, 〒2408501, JP)
国立大学法人横浜国立大学 (〒01 神奈川県横浜市保土ケ谷区常盤台79-1 Kanagawa, 〒2408501, JP)
Acing Technologies Co., Ltd. (1-11-35, Nishiyawata Hiratsuka-sh, Kanagawa 73, 〒2540073, JP)
株式会社 エーシングテクノロジーズ (〒73 神奈川県平塚市西八幡1-11-35 Kanagawa, 〒2540073, JP)
NISHINO Koichi (79-1. Tokiwadai, Hodogaya-ku Yokohama-sh, Kanagawa 01, 〒2408501, JP)
International Classes:
B01J19/18; B01D9/02; B01F7/26; B01J13/04
Domestic Patent References:
2009-01-15
Foreign References:
JP2006341232A2006-12-21
JP2007054817A2007-03-08
JP2001219054A2001-08-14
JP2002301363A2002-10-15
JP2004538125A2004-12-24
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Claims: