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Patent Searching and Data


Title:
CHEMICAL POLISHING LIQUID AND SURFACE TREATMENT METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/050204
Kind Code:
A1
Abstract:
The present invention provides a chemical polishing liquid which is used for aluminum or an aluminum alloy, and which contains (A) hydrogen peroxide, (B) a fluorine compound, (C) an inorganic acid that is not the fluorine compound (B), and (D) a hydroxyl group-containing hydrocarbon compound. The content of the hydrogen peroxide (A) is 2-20% by mass based on the total amount of the chemical polishing liquid; the content of the fluorine compound (B) in terms of fluorine atoms is 3-17% by mass based on the total amount of the chemical polishing liquid; the content of the inorganic acid (C) is 20-55% by mass based on the total amount of the chemical polishing liquid; and the content of the hydroxyl group-containing hydrocarbon compound (D) is 2-15% by mass based on the total amount of the chemical polishing liquid.

Inventors:
KUROSAWA SHIN-YA (JP)
FUJII TOMOKO (JP)
MATSUNAGA HIROSHI (JP)
Application Number:
PCT/JP2019/034388
Publication Date:
March 12, 2020
Filing Date:
September 02, 2019
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C23F3/03
Foreign References:
JP2013004132A2013-01-07
JP2004298938A2004-10-28
JP2012143798A2012-08-02
JPS503925A1975-01-16
CN106757039A2017-05-31
Other References:
AN, KIYOHITO ET AL.: "Non-official translation: Past and present information on chemical polishing and electrolytic polishing of aluminum", ALUMINUM FINISHING SOCIETY OF KINKI, no. 264, 2010, pages 1 - 6
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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