CHEMICAL SOLUTION, METHOD FOR PRODUCING MODIFIED SUBSTRATE, AND METHOD FOR PRODUCING LAYERED BODY

Title:

CHEMICAL SOLUTION, METHOD FOR PRODUCING MODIFIED SUBSTRATE, AND METHOD FOR PRODUCING LAYERED BODY

Document Type and Number:

WIPO Patent Application WO/2024/070526

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a chemical solution that is capable of forming a coating film in which material deposition from ALD treatment is suppressed. The chemical solution according to the present invention is used in semiconductor production. This chemical solution contains a silylation agent, an aprotic solvent and alcohol and has an alcohol content of 5 to 200 mass ppm with respect to the total mass of the chemical solution.

Inventors:

SATO KOICHI (JP)
MIZUTANI ATSUSHI (JP)
HAKAMATA AKIHIRO (JP)

Application Number:

PCT/JP2023/032336

Publication Date:

April 04, 2024

Filing Date:

September 05, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

H01L21/312; B05D7/00; B05D7/24; C23C16/40; C23C26/00; H01L21/304; H01L21/316

Foreign References:

JP2019123860A	2019-07-25
JP2019121777A	2019-07-22
JP2020172704A	2020-10-22
JP2010272852A	2010-12-02