Title:
CHEMICAL SOLUTION, AND METHOD FOR TREATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/138814
Kind Code:
A1
Abstract:
The present invention provides: a chemical solution which has an excellent ability to dissolve a transition metal-containing substance and can impart excellent smoothness to a part when the part is treated with the chemical solution; and a treatment method using the chemical solution. The chemical solution according to the present invention is a chemical solution which can be used for removing a transition metal-containing substance present on a substrate, and contains a periodic acid compound and a compound containing at least one anion selected from the group consisting of IO3
-, I- and I3
-, wherein the content of the compound containing the anion is 5 ppb by mass to 1% by mass relative to the whole mass of the chemical solution.
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Inventors:
TAKAHASHI TOMONORI (JP)
SUGIMURA NOBUAKI (JP)
SEKI HIROYUKI (JP)
SUGIMURA NOBUAKI (JP)
SEKI HIROYUKI (JP)
Application Number:
PCT/JP2018/046714
Publication Date:
July 18, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/304
Domestic Patent References:
| WO2016068183A1 | 2016-05-06 |
Foreign References:
| JP2002016053A | 2002-01-18 | |||
| JP2016092101A | 2016-05-23 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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