Title:
CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD FOR PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD FOR PATTERNED RESIST FILM, AND PRODUCTION METHOD FOR COMPOUND, PHOTO-ACID GENERATOR, AND N–ORGANOSULFONYLOXY COMPOUND
Document Type and Number:
WIPO Patent Application WO/2021/024925
Kind Code:
A1
Abstract:
The present invention aims to provide: a chemically amplified positive photosensitive resin composition that contains an acid generator having excellent solvent solubility and can readily form a resist pattern having excellent mask linearity; a photosensitive dry film comprising a photosensitive layer comprising the chemically amplified positive photosensitive resin composition; a production method for the photosensitive dry film; a production method for a patterned resist film using the chemically amplified positive photosensitive resin composition; and a compound and photo-acid generator that can be ideally blended in the chemically amplified positive photosensitive resin composition. The chemically amplified positive photosensitive resin composition includes: an acid generator (A) that generates acid using irradiation of active light rays or radiation; and a resin (B) that has a solubility in alkali that increases as a result of the action of the acid. The acid generator (A) includes a compound indicated by formula (A1).
Inventors:
KAWAUE AKIYA (JP)
Application Number:
PCT/JP2020/029366
Publication Date:
February 11, 2021
Filing Date:
July 30, 2020
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C07D221/14; C07D411/12; C07D497/08; C09K3/00; G03F7/004; G03F7/039; G03F7/20
Foreign References:
| JP2016222653A | 2016-12-28 | |||
| JP2010053121A | 2010-03-11 | |||
| JP2019066661A | 2019-04-25 | |||
| JP2016210983A | 2016-12-15 | |||
| JP2018002707A | 2018-01-11 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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