Title:
CHEMICALLY MECHANICAL POLISHING LIQUID AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/107406
Kind Code:
A1
Abstract:
The present invention relates to a chemically mechanical polishing liquid and an application thereof. The polishing liquid comprises grinding particles, an amino silane reagent, and water. The present invention is applicable to polishing of a blocking layer in a through silicon via (TSV) process, and may be further used to integrate polishing of a blocking layer in an integrated circuit copper interconnection process, polishing of a silicon dioxide interlayer dielectric, and polishing of a shallow slot isolation layer, and has a high blocking layer removal rate and high planarization efficiency in mild conditions. The polishing liquid can be used to prepare a high enriched product, can effectively reduce costs, and is convenient to store and transport.
Inventors:
CHEN BAOMING (CN)
GAO YUAN (CN)
JING JIANFEN (CN)
YAO YING (CN)
PAN YIJUN (CN)
QIU TENGFEI (CN)
WANG CHUNMEI (CN)
GAO YUAN (CN)
JING JIANFEN (CN)
YAO YING (CN)
PAN YIJUN (CN)
QIU TENGFEI (CN)
WANG CHUNMEI (CN)
Application Number:
PCT/CN2015/097542
Publication Date:
July 07, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
CHEN BAOMING (CN)
GAO YUAN (CN)
JING JIANFEN (CN)
YAO YING (CN)
PAN YIJUN (CN)
QIU TENGFEI (CN)
WANG CHUNMEI (CN)
GAO YUAN (CN)
JING JIANFEN (CN)
YAO YING (CN)
PAN YIJUN (CN)
QIU TENGFEI (CN)
WANG CHUNMEI (CN)
International Classes:
C09G1/02; C09G1/00; C09K3/14
Foreign References:
| CN102585704A | 2012-07-18 | |||
| CN101802116A | 2010-08-11 | |||
| CN101802125A | 2010-08-11 | |||
| US20040118051A1 | 2004-06-24 |
Attorney, Agent or Firm:
HANHONG LAW FIRM (CN)
上海翰鸿律师事务所 (CN)
上海翰鸿律师事务所 (CN)
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