Title:
CHILLER DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/110608
Kind Code:
A1
Abstract:
Provided is a chiller device having a function of enabling accurate and simultaneous heat-insulation control on workpieces having heat-insulation range conditions which are different from each other, by an inexpensive structure but without impairing the cooling performance and without applying overload to a compressor. In this device, when a coolant having a temperature reduced by cooling is flowed in to an evaporator 101-2 in a coolant cycle 200-2, to which a workpiece W2 is connected, through bypass flow paths formed by first to fourth flow paths connected to a cooling cycle 100 using an evaporator 101-1 in a coolant cycle 200-1 in a shared manner, to which a workpiece W1 is connected, the opening degree, at a valve EV2, of the second flow path is caused to be constant by a pulse signal, which a CPU has generated on the basis of a result obtained by performing PID calculation based on a coolant pressure sensed by a sensor P in the cycle 100 and based on a coolant temperature sensed by a sensor T3 in the cycle 100, and the opening degree, at a valve EV3, of the third flow path is variably set and the operation frequency at an electric compressor 102 is variably controlled within a predetermined range by drive-control signal output such that the flow rate of the coolant circulating, from the valve EV2, to the compressor 102 via a part of the first flow path converges on a target value.
Inventors:
UEDA TEIICHIROU (JP)
ISHIMATSU TAKUYA (JP)
HOSOI FUMIYUKI (JP)
ISHIMATSU TAKUYA (JP)
HOSOI FUMIYUKI (JP)
Application Number:
PCT/JP2016/087164
Publication Date:
June 29, 2017
Filing Date:
December 14, 2016
Export Citation:
Assignee:
SHINWA CONTROLS CO LTD (JP)
International Classes:
F25B5/02; F24F5/00; F24F11/02; F25B1/00; F25B5/00
Domestic Patent References:
| WO2015125669A1 | 2015-08-27 |
Foreign References:
| JP2008075919A | 2008-04-03 | |||
| JP2011247567A | 2011-12-08 | |||
| JP5377653B2 | 2013-12-25 |
Attorney, Agent or Firm:
THE PATENT BODY CORPORATE TAKEWA INTERNATIONAL PATENT OFFICE (JP)
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