Title:
CHIP AND BACKPLANE CONNECTOR INTERCONNECTION APPARATUS, AND COMMUNICATIONS DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/135561
Kind Code:
A1
Abstract:
A chip and backplane connector interconnection apparatus, and a communications device. The chip and backplane connector interconnection apparatus comprises a first IC chip and a first backplane connector, wherein the first IC chip is directly interconnected to the first backplane connector.
Inventors:
SHANG YINGCHUN (CN)
YE BING (CN)
CHEN XUN (CN)
YE BING (CN)
CHEN XUN (CN)
Application Number:
PCT/CN2019/128620
Publication Date:
July 02, 2020
Filing Date:
December 26, 2019
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01R12/71
Foreign References:
| CN108879150A | 2018-11-23 | |||
| CN2735566Y | 2005-10-19 | |||
| CN102906943A | 2013-01-30 | |||
| CN104641593A | 2015-05-20 | |||
| US7314387B1 | 2008-01-01 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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