CHIP-BONDING SYSTEM AND METHOD - SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD

Title:

CHIP-BONDING SYSTEM AND METHOD

Document Type and Number:

WIPO Patent Application WO/2017/101805

Kind Code:

A1

Abstract:

Disclosed are a chip-bonding system and method, which use a first moving platform (100) at a source end for supplying chips (10), a second moving platform (200) for rearranging the positions of the chips (10) and bearing a transfer plate (20), and a third moving platform (300) for bearing a substrate (30) to be bonded with the chips (10). Two moving mechanisms (010, 020) are used to grab the chips (10) and place the chips (10) between the three moving platforms. When the moving mechanism (010) grabs the chips (10) from the first moving platform (100) and places same on the second moving platform (200), the chips can be placed on the second moving platform (200) according to the state of the chips (10) when finally bonded with the substrate (30), that is, the chips (10) are rearranged according to the state of the chips (10) bonded with the substrate (30). After the transfer plate (20) is turned over once, the rearranged chips do not need to be arranged again when bonding with the substrate. In the whole chip-bonding system, it is only necessary for the turning-over mechanism to turn over once for all the chips to be bonded with the substrate in one step according to technological requirements. Consequently, production efficiency is increased, time is saved, and the requirement for mass production is met.

Inventors:

CHEN YONGHUI (CN)
TANG SHIYI (CN)
LI HUILI (CN)

Application Number:

PCT/CN2016/110057

Publication Date:

June 22, 2017

Filing Date:

December 15, 2016

Export Citation:

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Assignee:

SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD (CN)

International Classes:

H01L21/67; H01L21/56

Foreign References:

CN102655193A	2012-09-05
CN105470173A	2016-04-06
US6640423B1	2003-11-04

Other References: