FIELD OF INVENTION The present invention relates to a smaller chip card, and in particular to a smaller chip card with backward compatibility and an adaptor for portability of the smaller .. chip card.

BACKGROUND OF INVENTION In mobile communication systems, e. g. the PDC, the GSM, or IMT 2000 mobile communication system, subscriber identity modules SIM also referred to as chip cards or smart cards in the following are provided with different card formats.

A first format ID-1 shown in Fig. 1 is of larger size and therefore facilitates the handling of chip cards. Another format also shown in Fig. 1 is ID-000 provided for plug in chip cards and allows a significant reduction in size. Chip cards in the ID-1 format may be scored to allow break out an ID-000 card.

As shown in Fig. 2, chip cards usually have eight contacts, which are either used for voltage supply Vcc, reset input RST, clock CLK, ground GND, program voltage Vpp, input/output for serial communication I/O or reserved for future use RFU. The ISO standard 7816-1, 2 is one example for a specification of the position, the minimal size, and the usage of each contact. In mobile communication systems chip cards as illustrated above contain subscriber numbers and authentication algorithms.

In a more general sense, chip cards will also be referred to as universal integrated circuit cards UICC, e. g. , as described in ETSI TS 102.221.

One problem with available solutions is that the ID-000 format more and more restricts mobile terminal design, as the size of these mobile terminals becomes smaller and smaller.

Another problem in view of the introduction of smaller chip cards into the mobile communication network market is inter-operability with existing chip card readers/writers, e. g. , for initialisation and personalization when the chip card is issued or passed to the end user, and further inter-operability with mobile terminals. It should be noted, that existing chip card readers/writers are also referred to as legacy chip card readers/writers in the following and existing mobile terminals will be referred to as legacy mobile terminals.

In particular, backward compatibility issues with legacy mobile terminals are more important than the ones for other system components, because it is impossible to replace legacy mobile terminals at the end user side.

Yet another problem not addressed so far is the portability and handling of smaller chip cards for end users which gets more and more difficult with reduced size of the smaller chip cards. At the time of introduction of plug-in format ID-000-in addition to ID-1 which is still commonly used as banking/credit/telephone card format-, the excessive plastic compared to ID-1 was simply cut off and electrical contacts were kept as they were. This approach to portability will no longer work with smaller chip cards, as the dimensions thereof will simply be too small for direct handling through the end user.

SUMMARY OF INVENTION In view of the above, an object of the present invention is to achieve backward compatibility for smaller chip chards with legacy equipment, in particular legacy card readers/writers or legacy mobile terminals.

A further object of the present invention is to achieve a mechanism for convenient portability.

To achieve these objects, according to the present invention there is provided a smaller chip card which comprises a card body and a first contact area having dimensions and locations of contact according to a

predefined standard. Independent from the first contact area which is in compliance with the predefined standard there is provided a chip card area with an integrated circuit chip connected to contacts of a second contact area. The locations of contacts of the second contact area are different from locations of contacts in the first contact area.

It should be noted that the smaller chip card in the sense of the present invention is not restricted to a particular type of application, and may therefore also be referred to as portable electronic devices in a more general sense.

According to the present invention, it is proposed that the integrated circuit chip is physically and electrically connected, both, to the second contact area and also to contacts of the first contact area to achieve backward compatibility.

Therefore, the present invention allows to have two independent contact areas on the portable electronic device, the one being for standard compatibility and the other one being freely designable without restrictions imposed through pre-existing standards. Through the double connection of the integrated circuit chip to two different contact areas, backward compatibility is not only achieved in a mechanical sense-i. e. , such that the new portable electronic device may be inserted in legacy equipment-but also on an electrical level through connection of the integrated circuit chip to the first contact area being provided in compliance with a standard. This connection

allows for operation of the smaller chip and with legacy equipment.

Preferably, the standard for defining the first contact area may be one standard selected from, e. g. , ISO 7816-1, 2, ETSI UICC TS 102.221, ETSI GSM TS 11.11, TETRA TS 100 812-2/EN 300 812, ARIB PDC SDR-27,3GPP TS 31.101, and 3GPP2 TR45.

Therefore, backward compatibility is achieved irrespective of the type of application only in view of standards defining contact position and geometries. Typical examples would be backward compatibility in view of standards which are used in mobile communication systems, or further in view of standards used for banking/credit/telephone cards, e. g. , ISO 7816-1,2.

According to a preferred embodiment of the invention the card body format is ID-1, the first contact area is placed within an ID-000 part of the card body and the chip card area of the new smaller chip card chip card is placed outside the ID-000 on the card body. The first contact area may be arranged according to ISO 7816-1,2 and the integrated circuit chip may also be placed outside the contact area of the smaller chip card somewhere on the card body of ID-1 format. Typically, the integrated circuit chip is provided for the smaller chip card and links are provided from the integrated circuit chip back to the standardized contact area.

This preferred embodiment of the present invention is particularly well suited for smaller chip cards where backward compatibility is to be achieved when using ID-1 formats.

According to another preferred embodiment of the present invention the card body format of the portable electronic device is ID-1, the standardized first contact area is placed within an ID-000 part of the card body and also the smaller chip card is placed within the ID-000 part of the card body.

A first advantage of this preferred embodiment is that it is possible to achieve backward compatibility also with plug-in chip cards. Therefore, legacy chip card readers/writers and legacy terminals may use contacts according to ISO 7816-1,2 while the actual electrical interfaces are realized in the smaller chip card.

According to a further preferred embodiment, a punch out line is provided around the circumference of the ID-000 part of the card body so that this part may be broken out from the ID-1 card body.

This preferred embodiment of the present invention allows to achieve backward compatibility to different types of legacy equipment, i. e. legacy equipment adapted to ID-1 format or ID-000 format.

According to a further preferred embodiment-being related to the case where the smaller chip card is arranged on the

ID-000 part of the card body-a further reduction in size is achieved through provision of a cutting line between the standardized first contact area and the chip card area for the smaller chip card.

This cutting line allows for a separation of the ID-000 part having the first contact area and the smaller chip card into two different parts. Therefore, the final size of the smaller chip card after partitioning the ID-000 part is only determined by the design of the smaller chip card and the size of its contact area, not by pre-existing standards either for card formats or for contact design, e. g. , ISO 7816-1,2, ETSI UICC TS 102.221, GSM 11.11, TETRA TS 100 812-2/EN 300 812, ARIB PDC SDR-27,3GPP TS 31.101, and 3GPP2 TR45. This allows to achieve full design flexibility for the smaller chip card.

According to a further preferred embodiment being related to the cutting line, punch outs are provided along the cutting line and connections provided between the new smaller chip card and the standardized contact area pass aside the punch outs.

This preferred embodiment supports facilitated separation of the smaller chip cards from the standardized contact area for ease of handling.

According to a further embodiment of the present invention the cutting line is provided as straight line between the standardized contact area and the smaller chip card, which

further facilitates separation of the card body when the smaller chip card is handled as stand alone chip card.

Alternatively, the cutting line may be provided around the smaller chip card, e. g. , in U-or L-shape or as rectangle around the smaller chip card. The U-shape is of particular advantage when the smaller chip card is to be re-coupled to the ID-000 card body subsequent to a separation of the smaller chip card from the card body.

According to a further preferred embodiment of the present invention the contact area and the smaller chip card are provided on the same surface of the card body.

Alternatively, the contact area provided according to pre- existing standards and the smaller chip card are arranged on different surfaces of the card body.

Therefore, design flexibility is maximized as the side where the smaller chip card is provided on the card body is independent from the side of the contact area provided according to pre-existing standards.

The present invention as outlined so far relates to a single chip solution where a standardized contact area and a smaller chip card are provided on a card body.

According to a further aspect of the present invention, there is also provided a two chips solution where not only a single integrated circuit chip is provided on the portable electronic device but two integrated circuit chips.

The first integrated circuit chip is placed in compliance with the ID-1/ID-000 format on an contact area provided according to pre-existing standards, e. g. , the ISO 7816-1, 2 standard. The second integrated circuit chip and its related contact area may be freely designed to achieve maximum minimization.

Preferably, the card body is ID-1, the first integrated circuit chip is arranged according to ID-000 and the integrated circuit chip of the smaller chip card is arranged freely on the ID-1 card.

Optionally, two punch out lines are provided, the first one at the circumference of the chip card ID-000 and the second around the smaller chip card.

In this case the ID-1 card body achieves portability for the plug-in ID-000 chip card and the additional smaller chip card. Further, the two chip cards may be operated independently from each other.

According to a preferred embodiment, the smaller chip card and the ID-000 chip card may be connected to achieve backward compatibility.

Here, a first solution would be that the smaller chip card has connections to standardized contacts, e. g. , contacts provided according to ISO 7816-1,2, ETSI UICC TS 102.221, GSM 11. 11, TETRA TS 100 812-2/EN 300 812, ARIB PDC SDR-27, 3GPP TS 31.101, and 3GPP2 TR45.

An alternative would be that the ID-000 chip card and the smaller chip card are connected directly, enabling signal exchange between the two chips on the card.

A further aspect of the present invention relates to portability of the smaller chip cards or in other words the handling of the smaller chip card through the end user.

According to the present invention there is provided a chip card adaptor, or adaptor in short, of format ID-000 which is adapted to handle a smaller chip card with dimensions smaller than ID-000.

Preferably, the adaptor is provided with a contact area according to a predefined standard, e. g. , ISO 7816-1,2, ETSI UICC TS 102.221, GSM 11.11, TETRA TS 100 812-2/EN 300 812, ARIB PDC SDR-27,3GPP TS 31.101, and 3GPP2 TR45 to achieve backward compatibility.

Preferably, the smaller chip card can be separated from the adaptor and then be re-coupled to the adaptor, i. e. either with a legacy type of equipment or with a mobile terminal specifically designed for the smaller chip card.

Alternatively, the smaller chip card may be coupled to the adaptor for an one-time attachment.

According to a further embodiment of the present invention the chip card adaptor has a U-shaped cut out for accommodation of the smaller chip card. The lateral edge of this cut-out which gets into contact with the smaller chip

card has a profile according to the lateral edge profile of the smaller chip card. The profile may be a ditch profile or a projection profile.

According to a further preferred embodiment of the present invention the chip card adaptor is provided with contacts in the area where it gets in contact with the smaller chip card, e. g. , at the lateral edge of the cut-out towards the lateral edge of the smaller chip card.

This allows to maintain backward compatibility after re- coupling of the smaller chip card to the chip card adaptor.

A further aspect of the present invention relates to a smaller chip card being specifically adapted for portability.

The card body of the smaller chip card has a format with dimensions smaller than ID-000 and a chip card area with an integrated circuit chip connected physically and electrically to contacts of a contact area of the smaller chip card. This aspect of the present invention relates to a chip card body for the smaller chip card with an edge specifically adapted to connect the smaller chip card to a chip card adaptor.

According to a preferred embodiment of the smaller chip card the lateral edge is a profiled lateral edge and may have contacts for connecting the contacts of the contact area of the smaller chip card to an external adaptor for backward compatibility through the chip card adaptor.

A further aspect of the present invention relates to a terminal interface for a smaller chip card having dimensions smaller than ID-000 and being handled with a chip card adaptor according to the present invention.

The terminal interface has an opening for inserting the chip card adaptor. Therefore, the opening of the terminal interface may be wider than the smaller chip card itself, e. g. , be adapted to accommodate an ID-000 type chip card adaptor.

Further, the terminal interface has a locking unit adapted to separate the smaller chip card from the chip card adaptor through mechanical engagement with the smaller chip card when the terminal interface is operated in a locking mode, e. g. , by pressing the smaller chip card down after it has been inserted into the opening of the terminal interface.

Preferably, the terminal interface may also be operated in an unlocking mode through an unlocking unit adapted to push the smaller chip card towards the chip card adaptor in the unlocking mode. Once the smaller chip card is reconnected to the related chip card adaptor, it may be removed through the opening of the terminal interface.

Preferably, the terminal interface comprises an interface allowing for determination of the locking or unlocking mode through the user of the terminal interface. The terminal

interface may either be achieved in a mechanical way or supported by software.

As outlined above, the different aspects of the present invention allow for backward compatibility of a smaller chip card not only in the sense of chip card format, e. g.

ID-1 or ID-000, but also in view of electrical contacts defined according to a predefined standard and therefore on an operative level.

At the same time, no restrictions for the design of smaller chip card are imposed leading to a minimal size of the smaller chip card. Portability is guaranteed through appropriate mechanisms for handling the smaller chip card and through provision of appropriate terminals for handling the smaller chip card.

DESCRIPTION OF DRAWING In the following preferred embodiments of the present invention will be described with reference to the drawing: Fig. 1 shows the ID-1 and ID-000 chip card format as usual chip card formats; Fig. 2 shows the arrangement of contacts in compliance with ISO 7816-1,2 as example for a standard defining an arrangement and dimensions of contacts;

Fig. 3 shows a first example for a smaller chip card having geometrical dimensions smaller than ID-000 according to the present invention; Fig. 4 shows a second example for a smaller chip card having geometrical dimensions smaller than ID-000 according to the present invention; Fig. 5 shows a first example for achieving backward compatibility according to the present invention; Fig. 6-10 show further examples for achieving backward compatibility according to the present invention; Fig. 11 show an example for a straight cutting line across an ID-000 card body; Fig. 12 shows an example for a U-shaped cutting line on an ID-000 card body; Fig. 13 shows an example for a L-shaped cutting line on an ID-000 card body; Fig. 14 shows a first example for achieving backward compatibility by physically and electrically linking an integrated circuit chip of a smaller chip card to a newly designed contact area and also to a contact area in compliance with a pre- existing standard;

Fig. 15 shows a second example for achieving backward compatibility by physically and electrically linking an integrated circuit chip of the smaller chip card to a newly designed contact area and also to contact area in compliance with pre- existing standards; Fig. 16 shows an example for a two chips portable electronic device where integrated circuit chips are connected to separate contact areas; Fig. 17 shows a further example for a double chip solution where integrated circuit chips are connected to different contact areas and, the integrated circuit chip of the smaller chip card is connected for backward compatibility; Fig. 18 shows a further example for a double chip solution where integrated circuit chips are connected to different contact areas, and, the integrated circuit chip of the smaller chip card is connected for backward compatability; Fig. 19 shows an example of the connectors provided between the contact area of the smaller chip card and the contact area arranged according to Fig.

14 or 15; Fig. 20 shows contacts provided in a conductor between the smaller chip cards and the contacts arranged on ID-000;

Fig. 21 shows a first example for bonding the integrated circuit chip of the smaller chip card so as to achieve backward compatibility; Fig. 22 shows a second example for bonding the integrated circuit chip of the smaller chip card so as to achieve backward compatibility; Fig. 23 shows a cross sectional view of a portable electronic device with backward compatibility; Fig. 24 shows a cross sectional view of a further portable electronic device with backward compatibility; and Fig. 25 shows portability mechanisms suitable for a smaller chip card according to the present invention and a smaller chip card provided with a fixing for coupling to a related chip card adaptor.

DESCRIPTION OF PREFERRED EMBODIMENTS In the following preferred embodiments of the present invention will be described with reference to the drawings.

Heretofore, reference will be made to smaller chip cards.

A first example for a smaller chip card having dimensions smaller than ID-000 or in other words close to silicon is

shown in Fig. 3. Different contacts are arranged along two parallel lines. E. g. , the contacts are used for voltage supply Vcc, reset input RST, clock CLK, ground GND, program voltage Vpp, input/output for serial communication I/O. Of course, the ordering of the contacts along the lines may be permutated or one or more contact (s) may be omitted or added.

A second example for a smaller chip card having dimensions close to silicon is shown in Fig. 4. The smaller chip card differs from the smaller chip card shown in Fig. 3 in that contacts are arranged a single line only. Again, the indicated use of contacts is to be considered as an example for the present invention only and may be freely varied, e. g. , the ordering of the contacts along the line may be permutated or one or more contact (s) may be omitted or added.

Overall smaller chip cards according to the present invention may understood as smaller universal integrated circuit cards, e. g. , smaller UICCs having reduced dimensions, and therefore may also be referred to as portable electric devices in the most general sense.

Fig. 5 shows a first example for the portable electronic device according to the present invention. The portable electronic device has a card body 10 in compliance with the ID-1 format. A part 12 of the card body also referred to as plug-in part is arranged according to the ID-000 format. As part of the plug-in part there is provided a contact area in compliance with the pre-defined standards, e. g. , ISO

7816-1, 2, ETSI UICC TS 102.221, GSM 11.11, TETRA TS 100 812-2/EN 300 812, ARIB PDC SDR-27,3GPP TS 31.101, and 3GPP2 TR45.

The contacts arranged in the ID-000 part of the card body 10 will also be referred to as contacts in ID-000 in the following.

Further, as shown in Fig. 5 the card body 10 has a smaller chip card. The smaller chip card 16 comprises an integrated circuit chip placed over a contact area. Although not shown in Fig. 5, the integrated circuit chip may be placed separately from the contact area of the smaller chip card somewhere on the ID-1 chip card.

As shown in Fig. 5, the integrated circuit chip of the smaller chip card is mounted on the contact area of the smaller chip card. Further, the smaller chip card is arranged outside the ID-000 part of the card body. Contacts in the contact area of the smaller chip card are linked to the contacts in the ID-1/ID-000 part via connections 18 which will be explained in the following with reference to Fig. 14 and 15. Therefore, for communication with the smaller chip card the contacts of ID-1/ID-000 may be used to achieve backward compatibility with legacy card reader/writers and/or legacy mobile terminals. Further, the contacts of the smaller chip card may be used for, e. g., new terminals adapted to the design of the smaller chip card.

According to the present invention it is also possible to connect contacts of the smaller chip card with contacts in the ID-000 area reserved for future use. This allows to extend the functionality of the smaller chip card to a data exchange, e. g. , according to the USB standard, RS232, etc., for related functionality of the smaller chip card.

The smaller chip card shown in Fig. 5 is in compliance with a single chip solution where a single integrated circuit chip is mounted on the contact area of the smaller chip card. However, the smaller chip card may also be provided as a double chip solution where an additional integrated circuit chip is mounted on the contacts in ID-000.

Fig. 6 shows a second example for a portable electronic device according to the present invention. Those parts corresponding to elements explained previously with respect to Fig. 5 are denoted using the same reference numerals.

As shown in Fig. 6, according to the second example the smaller chip card 16 is arranged within ID-000. Contacts of the smaller chip card 16 are linked with the contacts 14 provided in ID-000 via connections which will be explained further in the following with reference to Fig. 14 and 15.

Therefore, the contacts 14 provided according to pre- existing standards are used as electrical interface to the smaller chip card 16. Therefore, legacy card readers/writers and legacy terminals may use the contacts 14 provided according to pre-existing standards for backward compatibility Even if the ID-000 part is plugged out, it would still work with legacy terminals. Also, the

smaller chip card 16 has contacts as electrical interface to terminal equipment adapted specifically to the smaller chip card 16.

Fig. 7 shows a further example of a portable electronic device according to the present invention, related to the examples shown in Fig. 5. Here, further to the elements explained with respect to Fig. 5 there is provided a punch- out line 20 around the smaller chip card 16 in the ID-1 card body. This allows to remove the smaller chip card from the ID-1 card body for subsequent use of the smaller chip card 16.

Fig. 8 shows a further example of the electronic portable device according to the present invention. Here, a further punch-out line 22 is provided along the circumference of ID-000. This example is particularly suited for a two-chip solution. In this case, the end user may be provided with the plug-in chip card and the smaller chip card using the ID-1 card and may then either use the ID-000 plug-in chip card or the newly designed smaller chip card after punch out from the ID-1 card. Further, he/she may use both chip cards in combination.

Fig. 9 shows a modification of the electronic portable device shown in Fig. 6. Those parts previously explained are denoted using the same reference numeral.

As shown in Fig. 9, this example relates to the provision of the smaller chip card in ID-000.

There is provided a cutting line crossing the ID-000 part between the ID-000 contacts and the smaller chip card arranged within ID-000. Further, there is provided a punch- out line around the ID-000.

The arrangement shown in Fig. 9 allows for a break-out of the ID-000 part from the card body in ID-1 format. Also, the ID-000 part may be divided using the cutting line. This operation is facilitated when the fixing part 28 remaining for attachment of the ID-000 part to the card body of ID-1 part and the cutting line 24 runs along a different direction, e. g. , perpendicular to each other. During removal of the ID-000 part then no force will be applied to the cutting line.

Fig. 10 shows a further example of the portable electronic device according to the present invention. Those parts previously described with respect to Fig. 9 are denoted using the same reference numerals.

As shown in Fig. 10, there are provided punch-outs 30,32, and 34 along the cutting line 24 for easier partitioning of the ID-000 part. The connections provided for a backward compatibility between the smaller chip card and the contacts provided according to pre-existing standards cross the cutting line in sections 24-1 and 24-2 aside the punch- outs 30,32 and 34.

The example shown in Fig. 10 facilitates the separation of the smaller chip card from the remaining ID-000 part.

While above examples of the present invention are given with respect to the ID-1 format, the following examples are related to a smaller backward compatibility using ID-000.

As shown in Fig. 11, the provision of an ID-1 card for support of contacts in the ID-000 area and simultaneously a smaller chip card 16 is not mandatory. To the contrary, the ID-000 part may be delivered as such. Optionally, the ID- 000 part may be provided with the cutting line as explained previously with respect to Fig. 9 and 10.

As shown in Figs. 12 and 13, the cutting line may be U- shaped or L-shaped. In particular, the U-shaped cutting line is well suited for enabling a re-coupling of the smaller chip card 16 to the ID-000 part after separation.

The further cutting lines according to Figs. 9 and 11 are suited for situations where the smaller chip card is distributed with the ID-000 part and is separated only once for subsequent use.

While above different aspects of arrangement of ID-000 contacts in combination with a smaller chip card either on a ID-1 card or a ID-000 card have been described with reference to Figs. 5 to 13, in the following further aspects of achieving backward compatibility will be discussed with respect to Figs. 14 to 18.

Figs. 14 and 15 are related to a single chip solution.

The ID-000 part has a contact area 14 and the smaller chip card comprises an integrated circuit chip 36 and a further

contact area 38. As shown in Fig. 14, the contact area 38 of the smaller chip card has contacts with locations being different from contacts in the contact area 14. Further, also the number of contacts in the contact area 38 may be different from the number of contacts in the contact area 14.

As shown in Fig. 14, the integrated circuit chip 36 of the smaller chip card is bonded to the contact area 38 with a connection 40. Further, the integrated circuit chip 36 is also connected with a related contact 42 of the contact area 14 using a connection 44. Therefore, the connections 40 and 44 are provided separately from each other.

A further example is shown in Fig. 15. The elements described above with respect to Fig. 14 are denoted using the same reference numerals.

According to Fig. 15 the integrated circuit chip 36 of the smaller chip card is not directly connected to the contact area 14. To the contrary, corresponding contacts in the contact area 38 of the smaller chip card and the contact area 14 provided for backward compatibility are linked by a connection 46.

While according to Fig. 15 the connection 46 is provided between corresponding contacts of the contact area 38 of the smaller chip card and the contact area 14, it may nevertheless also branch off from the connection 40 provided to bond the integrated circuit chip 36 to the contact area 38.

Further examples for connection patterns for a double chip solution of the portable electronic device according to the present invention are shown in Figs. 16 to 18. Those elements described above with reference to Figs. 14 and 15 are denoted with the same reference numerals.

As shown in Fig. 16, in addition to the integrated circuit chip 36 of the smaller chip card there is provided an additional integrated circuit chip 48 being bonded to the contacts in ID-000 using a connection 50. For the example shown in Fig. 14, there is provided no connection from the integrated circuit chip 36 of the smaller chip card to the contact area 14. Nevertheless, the related smaller chip card is backward compatible as an integrated circuit chip is provided also in relation to the contact area 14 in ID- 000.

According to the double chip solution shown in Fig. 16, the two integrated circuit chips operate independently. The external terminal system or the card reader/writer handle activation or coordination of inter-operation thereof, e. g., copy of information from one integrated circuit chip to another.

A further example is shown in Fig. 17. Here, further to the example shown in Fig. 14 there is provided an additional connection 52 from the integrated circuit chip 36 of the smaller chip card to a related contact in the ID-000 area for backward compatibility of the smaller chip card.

For the double chip solution shown in Fig. 17 external systems like the terminal or the card reader/writer take responsibility for the relevance and activation of integrated circuit chips 36,48. In particular, the external system may switch the integrated circuit chips via the contact area 14.

According to a further example shown in Fig. 18 a connection 54 is provided to achieve a backward compatibility from the smaller chip card to the contact area 14. The connection 54 is not connected directly to the contact area 14 but to the integrated circuit chip 48. This allows for data exchange between the integrated circuit chips 48 and 36. Once data generated in the integrated circuit chip 36 of the smaller chip card is available in the integrated circuit chip 48, it may then be forwarded to the related contact in the contact area 14.

A further example shown in Fig. 18 is adapted to connect the integrated circuit chip 36 of the smaller chip card to a contact of the ID-000 contact area 14 which is reserved for further use RFU. This option of the present invention allows, e. g. , for data transmission according to RS232 or USB via the reserved contact.

While different examples to achieve backward compatibility have been explained with respect to Figs. 14 to 18, in the following further details for realizing connections will be explained with respect to Figs. 19 to 22.

One option to realize connections for backward compatibility is based on a card body with a multi-layer structure, i. e. having a plurality of films.

As shown in Fig. 19, the connections between the contact area 38 of the smaller chip card and the contact area 14 provided for backward compatibility are realized through a number of wires/conductors 18-1,..., 18-6 on one of the films 58. The wires/conductors may be provided on only one side of the film or on both sides of the films or on different films.

For the example shown in Fig. 19, it is assumed that the contact area 38 for the smaller chip card has contacts Vcc, RST, TLK, GND, Vpp, I/O in accordance with ISO 7860-1,2 and each contact in the contact area 38 is connected for backward compatibility with the contact area 14.

As shown in Fig. 20, the conductors provided on the film 58 may pass the cutting line explained above and shown in Figs. 9 to 13. In particular, for achieving a separation and a re-connection of each conductor 18-1,..., 18-6 one side of each conductor would have a wider surface 60 for re-connection. Alternatively, both sides may be provided with a wider surface.

In the following further details of mounting the integrated circuit chip of the smaller chip card on the related contact area will be explained referring to Figs. 21 and 22.

As shown in Fig. 21, the integrated circuit chip 36 of the smaller chip card is embedded into a die-coating 62. The integrated circuit chip 36 is bonded to a contact 64 of the contact area 38 with a bonding wire 66. To achieve backward compatability, a further bonding wire 68 branches off to the related contact of the contact area 14 on ID-000.

Further elements shown in Fig. 21 are a laminate glue 70 and a glass epoxy element 72.

A further example for mounting achieving the integrated circuit chip of the smaller chip card is shown in Fig. 22.

Those elements described previously with respect to Fig. 21 are denoted using the same references numerals.

The example shown in Fig. 22 is different from the one previously described in that the bonding wire 66 branches off to the related contact of the contact area 14 on ID- 000.

While for the examples shown in Figs. 21 and 22 only a single bonding wire is shown, it is to be understood that the number of wires to achieve backward compatibility is determined by the number of contacts of the smaller chip card.

Further details of a portable electronic device with a smaller chip card and backward compatibility will be explained with reference to Figs. 23 and 24. Elements previously explained with respect to Figs. 21 and 22 will be referenced using the same reference numerals.

As shown in Fig. 23, the card body 10, e. g. , according to ID-1 or ID-000, is provided to support both the contact area 14 provided for backward compatibility and the contact area 38 in relation to the smaller chip card. The cross sectional view shows two contacts 14-1 and 14-2 for the first contact area and two contacts 38-1 and 38-2 for the contact area of the smaller chip card.

Supplement to the explanations given with respect to Figs.

21 and 22, Fig. 22 shows how conductors 68-1 and 68-2 branch off from contact areas 38-1 and 38-2, respectively, to the contact 14-1 and 14-2 to achieve backward compatibility.

As shown in Fig. 23, the cutting line 24 is provided as a notch. The conductors 68-1 and 68-2 cross the cutting line in that part of the card body 10 that is not removed to form the notch. It should be noted that also the provision of bonding wires branching off as shown in Fig. 22 may be applied to the structure shown in Fig. 23.

Fig. 24 shows a further example for the electronic portable device having a smaller chip card with backward compatibility. Those elements explained previously with respect to Fig. 23 are denoted using the same reference numerals.

The example shown in Fig. 24 differs over the example in Fig. 23 in that the die-coating 62 is not only provided in the surroundings of the integrated chip 36 of the smaller chip card but is extended in the chip card body 10 to the

contact area 14. The die-coating may be covered with a hot melt foil 72.

As shown in Fig. 24, according to this further example the conductors 68-1 and 68-2 are not running in the card body 10 but in the die-coating 62.

In the following further aspects of the present invention being related to portability of the smaller chip card and a related terminal will be explained with reference to Fig.

25.

Generally, the structure shown in Fig. 25 provides a chip card interface terminal 76, also referred to as interface terminal in the following, adapted to separate a smaller chip card from an adaptor 78 when inserted in the terminal 76. Further, the smaller chip card may be attached to the adaptor 78 again after use of the smaller chip card. Thus, the adaptor allows easy handling of the smaller chip card.

Further, the adaptor may support backward compatibility in the sense outlined above, so that legacy terminals may accept a smaller chip card attached to the adaptor.

As shown in Fig. 25, there may be provided different interfaces for the smaller chip card, i. e. a UICC interface in a legacy terminal 74 and a UICC interface in a new terminal 76.

The smaller chip card with the adaptor 78 may be inserted into the legacy terminal 74. Further, the new terminal 76 for the smaller chip card may be reduced in depth, even if

the width and height of its opening 80 is the same as that of the legacy terminal 74. This allows to make new terminals smaller and supplies flexibility in terminal design, i. e. mobile terminals.

In the following the structure of the chip card adaptor will be explained in more detail.

The chip card adaptor may have a format ID-000 for legacy terminals. For inter with the new terminal 76 it should have a fixing which allows to remove the smaller chip card from the chip card adaptor 78 for use within the new terminal 76 and then to attach the smaller chip card to the chip card adaptor 78 again. Alternatively, the fixing may achieve one-time attachment.

As shown in Fig. 25, one way to achieve this is to provide the chip card 78 with a cut out 82 at one side thereof. The lateral edge of the cut out 82 gets into engagement with the lateral edge of the smaller chip card during attachment of the smaller chip card to the chip card adaptor 78.

Fixing of the smaller chip card to the chip card adaptor is achieved by providing the lateral edge of the cut out 82 with a profile and by providing the lateral edge of the smaller chip card 78 with a profile that is the counter part of the profile of the lateral edge of the cut out 82.

One option is to provide the lateral edge of the cut out 82 with a ditch profile 84 and the lateral edge of the smaller chip card with a projection 86 or vice versa.

An alternative to the approach using a profile would be to provide pins, e. g. , at the front of the cut out 82 which pins get into engagement with hollow spaces formed in the smaller chip card.

Further, the adaptor 78 may be provided with contacts according to ISO 7816-1, 2 for backward compatibility. In this case, connectors provided for backward compatibility pass the lateral edge of the cut out 84 via related contacts (not shown in Fig. 25).

The lower part of Fig. 25 shows further details of the new terminal 76 for handling the smaller chip card with the adapter 78. The new terminal 76 has an opening 80 with a width according to ID-000. Further, the new terminal 76 comprises a hardware mechanism adapted to press down only a smaller chip card part of the adaptor/smaller chip card combination inserted into the opening 80. For operating the new terminal 76 in an unlock mode, the new terminal 76 has a hardware mechanism to insert the smaller chip card part back into the adaptor 78. E. g. , at the bottom of the terminal interface there may be provided a pusher adapted to push the smaller chip card back into the cut out 82 of the adaptor 78. After re-insertion of the smaller chip card into the adaptor 76 the adaptor together with the smaller chip card may then be removed from the new terminal 76 for further handling.

Overall, the operation of the new terminal shown in Fig. 25 may be divided into the following sub-steps: A smaller chip card with an adaptor 78 is inserted into a new terminal 76

for the smaller chip card. Then, the mode of the new terminal 76 is set to"lock", so that the smaller chip card is pressed down. Hereafter, the adaptor 78 is removed from the new terminal 76 and after operation of the new terminal 76 the adaptor 78 may be inserted again into the new terminal. Here, the new terminal 76 will be set into the "unlock"mode which means that the smaller chip card part is pushed by the button of the terminal interface mechanism to remove the smaller chip card into the adaptor 78. The "lock/unlock"mode of the new terminal may be determined by the user either using a related button of the terminal 76 or through a terminal interface being suitable programmed, i. e. via interface software.