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Patent Searching and Data


Title:
CHIP COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/004276
Kind Code:
A1
Abstract:
The present invention provides a chip component and a manufacturing method therefor, the chip component comprising a laminate, and a surface modified member formed on at least one region of the laminate, wherein the surface modified member exposes at least a portion of the surface of the laminate.

Inventors:
BACK JUNG CHEEL (KR)
LEE JUNG HUN (KR)
KIM JUNG CHAI (KR)
KIM JOO SUNG (KR)
Application Number:
KR2017/006909
Publication Date:
January 04, 2018
Filing Date:
June 29, 2017
Export Citation:
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Assignee:
MODA-INNOCHIPS CO LTD (KR)
International Classes:
H01G4/40; C01G9/02; C01G29/00; C01G45/02; C01G51/00; H01F17/00; H01G2/14; H01G4/232; H01G4/30
Domestic Patent References:
WO2014147898A12014-09-25
Foreign References:
KR100204255B11999-06-15
KR20160072605A2016-06-23
KR20140025693A2014-03-05
KR20130136247A2013-12-12
Attorney, Agent or Firm:
NAM, SEUNG-HEE (KR)
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