Title:
CHIP COMPONENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/054338
Kind Code:
A1
Abstract:
Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.
Inventors:
OGUMA ISAMU (JP)
OGATA TAKATOMO (JP)
FUNAHASHI SHIGERU (JP)
OTA HIDETAKE (JP)
OGATA TAKATOMO (JP)
FUNAHASHI SHIGERU (JP)
OTA HIDETAKE (JP)
Application Number:
PCT/JP2018/033487
Publication Date:
March 21, 2019
Filing Date:
September 10, 2018
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
NGK CERAM DEVICE CO LTD (JP)
NGK CERAM DEVICE CO LTD (JP)
International Classes:
H01L21/301; H01G4/30; H01L21/683
Foreign References:
| JP2015066658A | 2015-04-13 | |||
| JP2001284163A | 2001-10-12 | |||
| JP2009246134A | 2009-10-22 | |||
| JP2009246167A | 2009-10-22 | |||
| JP2005259964A | 2005-09-22 | |||
| JP2011066308A | 2011-03-31 |
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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