Title:
CHIP COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/111497
Kind Code:
A1
Abstract:
[Problem] There is a need for a chip component which has excellent mountability, which can accommodate multiple types of requested values with a common basic design, and which has improved geometric accuracy and micromachining accuracy. [Solution] A chip resistor (10) (chip component) which includes: a substrate (11); an element circuit network (20, 21) which includes multiple element components formed on the substrate (11); an external connection electrode (12) provided on the substrate (11) for external connection to the element circuit network (20, 21); multiple fuses provided on the substrate (11) for detachably connecting the element components and the external connection electrode (12); and a solder layer (124) formed on the external connection terminal of the external connection electrode (12). [Effect] Because the external connection electrode (12) provided on the chip resistor (10) includes a solder layer (124) on the outside connection terminal, during mounting of the chip resistor (10), the chip resistor (10) can be easily mounted without solder printing. Further, the amount of solder used for mounting is decreased, and chip resistors (10) can be achieved in which solder extrusions do not occur and which can be mounted with high density.
Inventors:
TAMAGAWA HIROSHI (JP)
YAMAMOTO HIROKI (JP)
MATSUURA KATSUYA (JP)
KONDO YASUHIRO (JP)
YAMAMOTO HIROKI (JP)
MATSUURA KATSUYA (JP)
KONDO YASUHIRO (JP)
Application Number:
PCT/JP2012/083570
Publication Date:
August 01, 2013
Filing Date:
December 26, 2012
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01G2/06; H01C7/00; H01C13/02; H01C17/22; H01G4/255; H01L21/822; H01L27/04
Foreign References:
| JPH09306710A | 1997-11-28 | |||
| JPS636804A | 1988-01-12 | |||
| JP2000294402A | 2000-10-20 | |||
| JPH0415825U | 1992-02-07 |
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
Kosaku Inaoka (JP)
Kosaku Inaoka (JP)
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Claims:
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