Title:
CHIP COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/163120
Kind Code:
A1
Abstract:
Provided is a chip component having high heat shock resistance. A chip resistor 1 according to the present invention comprises: a cuboidal insulating substrate 2; a pair of rear surface electrodes 3 provided to both longitudinal direction ends of the rear surface of the insulating substrate 2; a pair of front surface electrodes 4 provided to both longitudinal direction ends of the front surface of the insulating substrate 2; a resistor 5 provided between the pair of front surface electrodes 4; and a pair of end surface electrodes 6 provided in a cross-sectional U shape to both longitudinal direction end surfaces of the insulating substrate 2 so as to bridge the gap between the rear surface electrodes 3 and the front surface electrodes 4, wherein the rear surface electrodes 3 are formed by a first electrode part 3a positioned on the inner side separated from the end surface of the insulating substrate 2, and two second electrode parts 3b arranged in the widthwise direction of the insulating substrate 2 across a cutout part 3c present between the end surface of the insulating substrate 2 and the first electrode part 3a, and the maximum height of the first electrode part 3a is set to be higher than the maximum height of the second electrode part 3b.
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Inventors:
AKAHANE YASUSHI (JP)
Application Number:
PCT/JP2021/044273
Publication Date:
August 04, 2022
Filing Date:
December 02, 2021
Export Citation:
Assignee:
KOA CORP (JP)
International Classes:
H01C7/00; H01C1/016
Foreign References:
| JP2020150273A | 2020-09-17 | |||
| JP2020170747A | 2020-10-15 | |||
| JPH10223404A | 1998-08-21 | |||
| JPS5961503U | 1984-04-23 |
Attorney, Agent or Firm:
THE PATENT BODY CORPORATE TAKEWA INTERNATIONAL PATENT OFFICE (JP)
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