Title:
CHIP CONDENSER, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/069363
Kind Code:
A1
Abstract:
This chip condenser comprises a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a two-way diode connected in parallel to the capacitor element between the pair of external electrodes. This circuit assembly comprises this chip condenser, and a mounting substrate having a land soldered to the external electrodes on the mounting surface disposed opposite the surface of the substrate.
Inventors:
YAMAMOTO HIROKI (JP)
WATANABE KEISHI (JP)
TAMAGAWA HIROSHI (JP)
WATANABE KEISHI (JP)
TAMAGAWA HIROSHI (JP)
Application Number:
PCT/JP2013/078969
Publication Date:
May 08, 2014
Filing Date:
October 25, 2013
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01G4/40; H01G4/12
Foreign References:
| JPH0621325A | 1994-01-28 | |||
| JP2004179572A | 2004-06-24 | |||
| JPH0513201A | 1993-01-22 | |||
| JP2009059990A | 2009-03-19 | |||
| JPH0955625A | 1997-02-25 | |||
| JPH10256083A | 1998-09-25 | |||
| JPH09246093A | 1997-09-19 |
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
Kosaku Inaoka (JP)
Kosaku Inaoka (JP)
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