Title:
CHIP DEVICE FOR MANIPULATING OBJECT COMPONENT, AND METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/094322
Kind Code:
A1
Abstract:
[Problem] To provide a device in which a plurality of liquid substances such as reagents required for a series of manipulations on a sample are stably secured in separated states throughout the manipulations within the device.
[Solution] A chip device for manipulating an object component comprises: a manipulation chip (1) comprising a substrate (2), a groove (3) formed in the surface of the substrate, and a manipulation medium accommodated in the groove such that gel phases (g) and aqueous liquid phases (l) are alternately disposed in the longitudinal direction of the groove (3) and are in contact with each other; magnetic particles to capture and carry the object component; and a magnetic field application means capable of moving the magnetic particles in the longitudinal direction of the groove in the substrate by the application of a magnetic field to the substrate.
Inventors:
KATASHO ISAO (JP)
OHASHI TETSUO (JP)
OHASHI TETSUO (JP)
Application Number:
PCT/JP2012/078587
Publication Date:
June 27, 2013
Filing Date:
November 05, 2012
Export Citation:
Assignee:
SHIMADZU CORP (JP)
International Classes:
G01N35/08; C12M1/00; C12M1/34; G01N37/00
Foreign References:
| JP2011232260A | 2011-11-17 | |||
| JP2008039541A | 2008-02-21 | |||
| JP2004045410A | 2004-02-12 |
Attorney, Agent or Firm:
KITA, Toshifumi et al. (JP)
Toshifumi Kita (JP)
Toshifumi Kita (JP)
Download PDF:
Claims: