Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHIP ELECTRONIC COMPONENT AND MODULE
Document Type and Number:
WIPO Patent Application WO/2016/133090
Kind Code:
A1
Abstract:
[Problem] To provide a chip electronic component which is not susceptible to cracking. [Solution] A chip electronic component which is provided with: an electronic component main body 1 having an internal conductor layer 7; and an external electrode 3 that is provided on the electronic component main body 1. The external electrode 3 comprises: a base electrode 14 that is provided on the electronic component main body 1; and a plating film 15 that has pores 17 and is provided on the base electrode 14. Pores 17 on the base electrode 14 side have a smaller average diameter than pores 17 on the surface 16 side. In addition, the pores 17 on the base electrode 14 side have an average diameter of 0.10 μm or less.

Inventors:
FUJIKAWA,Nobuyoshi (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2016/054444
Publication Date:
August 25, 2016
Filing Date:
February 16, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01G4/252; H01G4/228; H01G4/232; H01G4/30
Foreign References:
JP2013207203A2013-10-07
JP2006100359A2006-04-13
JP2015026864A2015-02-05
JP2015005607A2015-01-08
JP2000049034A2000-02-18
JPH11297565A1999-10-29
JP2006332284A2006-12-07
JPH04236412A1992-08-25
Download PDF: