CHIP FOR EVALUATING BOARD, AND BOARD EVALUATING DEVICE

WIPO Patent Application WO/2019/163862

A1

A board evaluating device (1) is used to perform a test for evaluating the thermal characteristics of a ceramic wiring board (30) on which a power semiconductor can be mounted, in a state in which a pseudo heat generating chip (40) has been mounted on the surface of the ceramic wiring board (30), wherein the board evaluating device (1) is provided with a load control unit (10) provided with a plurality of electrode rods (130) for pressing the ceramic wiring board (30) against a heat sink (100) by means of a load, by way of a plurality of pad bonding patterns (34ep), a heating power source (14) for causing a heating pattern (46) on the pseudo heat generating chip (40) to apply heat by way of some of the plurality of electrode rods (130), and a temperature measuring sensor (16) for measuring the surface temperature of the pseudo heat generating chip (40) by way of some of the plurality of electrode rods (130), using a temperature measurement pattern (48), and wherein the board evaluating device (1) evaluates the thermal characteristics of the ceramic wiring board (30) on the basis of the surface temperature measurement result obtained by the temperature measuring sensor (16).

SUGANUMA KATSUAKI (JP)
NAGAO SHIJO (JP)
SHIMOYAMA AKIO (JP)
KIM DONGJIN (JP)
TAKESHITA KAZUTAKA (JP)
WAKASUGI NAOKI (JP)

PCT/JP2019/006438

August 29, 2019

February 21, 2019

Click for automatic bibliography generation  

UNIV OSAKA (JP)
YAMATO SCIENT CO LTD (JP)

G01N25/18

WO2010064487A1

2010-06-10

CN1544954A	2004-11-10
JP2001141680A	2001-05-25
JP2012184990A	2012-09-27
JP2008304447A	2008-12-18
JPH05152303A	1993-06-18
JP2017173030A	2017-09-28

See also references of EP 3757559A4

MIYOSHI Hidekazu et al. (JP)

View/Download PDF      PDF Help

Previous Patent: SEALING RESIN COMPOSITION, LAMINATE SHEET, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUF...

Next Patent: LAMINATE SHEET