Title:
CHIP FOR EVALUATING BOARD, AND BOARD EVALUATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/163862
Kind Code:
A1
Abstract:
A board evaluating device (1) is used to perform a test for evaluating the thermal characteristics of a ceramic wiring board (30) on which a power semiconductor can be mounted, in a state in which a pseudo heat generating chip (40) has been mounted on the surface of the ceramic wiring board (30), wherein the board evaluating device (1) is provided with a load control unit (10) provided with a plurality of electrode rods (130) for pressing the ceramic wiring board (30) against a heat sink (100) by means of a load, by way of a plurality of pad bonding patterns (34ep), a heating power source (14) for causing a heating pattern (46) on the pseudo heat generating chip (40) to apply heat by way of some of the plurality of electrode rods (130), and a temperature measuring sensor (16) for measuring the surface temperature of the pseudo heat generating chip (40) by way of some of the plurality of electrode rods (130), using a temperature measurement pattern (48), and wherein the board evaluating device (1) evaluates the thermal characteristics of the ceramic wiring board (30) on the basis of the surface temperature measurement result obtained by the temperature measuring sensor (16).
Inventors:
SUGANUMA KATSUAKI (JP)
NAGAO SHIJO (JP)
SHIMOYAMA AKIO (JP)
KIM DONGJIN (JP)
TAKESHITA KAZUTAKA (JP)
WAKASUGI NAOKI (JP)
NAGAO SHIJO (JP)
SHIMOYAMA AKIO (JP)
KIM DONGJIN (JP)
TAKESHITA KAZUTAKA (JP)
WAKASUGI NAOKI (JP)
Application Number:
PCT/JP2019/006438
Publication Date:
August 29, 2019
Filing Date:
February 21, 2019
Export Citation:
Assignee:
UNIV OSAKA (JP)
YAMATO SCIENT CO LTD (JP)
YAMATO SCIENT CO LTD (JP)
International Classes:
G01N25/18
Domestic Patent References:
WO2010064487A1 | 2010-06-10 |
Foreign References:
CN1544954A | 2004-11-10 | |||
JP2001141680A | 2001-05-25 | |||
JP2012184990A | 2012-09-27 | |||
JP2008304447A | 2008-12-18 | |||
JPH05152303A | 1993-06-18 | |||
JP2017173030A | 2017-09-28 |
Other References:
See also references of EP 3757559A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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