Title:
CHIP-ON-FILM PUNCHING DEVICE AND DISPLAY DEVICE ASSEMBLY SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/098006
Kind Code:
A1
Abstract:
A chip-on-film punching device, comprising: a rotary shaft (110), configured to be sleeved with a material tray (210) wound with a chip-on-film material strip (220), the material tray (210) being provided with a marking structure (230) comprising model information about the chip-on-film, and the material tray (210) rotating along with the rotary shaft (110); a punching structure (120), configured to pull and punch the chip-on-film material strip (220); and an identification structure (130), configured to identify the marking structure (230), so as to identify the model information about the chip-on-film. A display device assembly system comprising the described chip-on-film punching device is further comprised.
Inventors:
WANG LIANG (CN)
ZHANG GUANGHUI (CN)
ZHANG GUANGHUI (CN)
Application Number:
PCT/CN2018/118659
Publication Date:
May 22, 2020
Filing Date:
November 30, 2018
Export Citation:
Assignee:
HKC CORP LTD (CN)
International Classes:
B26F1/44; B26D5/32; B26D7/27
Foreign References:
| CN107322685A | 2017-11-07 | |||
| CN106816555A | 2017-06-09 | |||
| CN102024677A | 2011-04-20 | |||
| CN203197470U | 2013-09-18 | |||
| CN108705571A | 2018-10-26 | |||
| CN207172259U | 2018-04-03 | |||
| JP2009194100A | 2009-08-27 | |||
| US7031791B1 | 2006-04-18 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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