Title:
CHIP HEAT DISSIPATION METHOD, SINGLE BOARD, ELECTRONIC DEVICE, COMPUTER DEVICE, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2024/021606
Kind Code:
A1
Abstract:
Embodiments of the present application provide a chip heat dissipation method, a single board, an electronic device, a computer device, and a computer-readable storage medium. The method comprises: according to first feature parameters of a plurality of chips, determining an allowable thermal resistance value of each chip (S101); determining a heat exchange mode of each chip, the heat exchange mode comprising a first heat exchange mode and a second heat exchange mode (S102); when the heat exchange mode is the first heat exchange mode, determining a heat dissipation mode of the corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold (S103); and when the heat exchange mode is the second heat exchange mode, determining a heat dissipation mode of the corresponding chip according to the allowable thermal resistance value and a second thermal resistance threshold (S104).
Inventors:
TAO CHENG (CN)
LIU FAN (CN)
ZHOU XIAODONG (CN)
LIU FAN (CN)
ZHOU XIAODONG (CN)
Application Number:
PCT/CN2023/079590
Publication Date:
February 01, 2024
Filing Date:
March 03, 2023
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
G06F1/20; F28D15/02
Foreign References:
| CN112902715A | 2021-06-04 | |||
| CN212988425U | 2021-04-16 | |||
| CN105682434A | 2016-06-15 | |||
| US20120279686A1 | 2012-11-08 |
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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