Title:
CHIP-LIKE ELECTRONIC COMPONENT JIG
Document Type and Number:
WIPO Patent Application WO/2021/039047
Kind Code:
A1
Abstract:
A chip-like electronic component jig (10) is provided with a first layer (11), a second layer (12), a third layer (13), and at least one of a fourth layer (14) and a fifth layer (15). The fourth layer (14) is positioned over the first layer (11). The fourth layer (14), when viewed from a stacking direction, is composed of a plurality of fourth linear members (14L) extending so as to overlap with a plurality of third linear members (13L), the number of the fourth linear members (14L) being not less than two and less than the number of the plurality of third linear members (13L). The fifth layer (15) is positioned over the first layer (11). The fifth layer (15), when viewed from the stacking direction, is composed of a plurality of fifth linear members (15L) extending so as to overlap with a plurality of second linear members (12L), the number of the fifth linear members (15L) being not less than two and less than the number of the plurality of second linear members (12L).
Inventors:
TANAKA YUTA (JP)
Application Number:
PCT/JP2020/023938
Publication Date:
March 04, 2021
Filing Date:
June 18, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G13/00
Foreign References:
| JP2008177188A | 2008-07-31 | |||
| JP2018193287A | 2018-12-06 | |||
| JP2003077776A | 2003-03-14 | |||
| JP2012144433A | 2012-08-02 | |||
| JP2006310763A | 2006-11-09 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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