Title:
CHIP MODULE, SIGNAL PROCESSING METHOD FOR SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/074230
Kind Code:
A1
Abstract:
The present invention relates to a chip module, a signal processing method for the same, and an electronic device that make it possible to verify change before and after module installation and simplify the design of a module for installation. In a gyro module, an MEMS device formed in a chip shape and an IC for processing a detection signal from the MEMS device are arranged vertically. The IC has therein a plurality of temperature sensors and stress sensors for external environment detection and outputs difference values arrived at by subtracting reference sensor values that were the sensor values of the temperature sensors and stress sensors at the time of calibration from the sensor values detected by the plurality of temperature sensors and stress sensors. This invention can be applied to, for example, a gyroscope module.
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Inventors:
MATSUMOTO TOMOHIRO (JP)
Application Number:
PCT/JP2017/036089
Publication Date:
April 26, 2018
Filing Date:
October 04, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G01C19/5776; G01D3/028; H01L29/84
Domestic Patent References:
| WO2012147348A1 | 2012-11-01 |
Foreign References:
| JP2005257623A | 2005-09-22 | |||
| US20110113891A1 | 2011-05-19 | |||
| JP2002111388A | 2002-04-12 | |||
| JPS60154677A | 1985-08-14 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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