Title:
CHIP MODULE
Document Type and Number:
WIPO Patent Application WO/2022/257535
Kind Code:
A1
Abstract:
Provided in the present disclosure is a chip module, comprising a circuit board and at least one chip packaged on the circuit board. The chip module further comprises a reinforcing ring, which is arranged around the circuit board and comprises a plurality of reinforcing side walls and a plurality of limiting portions, wherein the plurality of reinforcing side walls are sequentially connected to form a frame shape, and are attached to side faces of the circuit board; at least one reinforcing side wall is provided with at least one limiting portion; and each limiting portion extends towards the middle of the circuit board from the reinforcing side wall provided with the limiting portion.
Inventors:
SONG TINGTING (CN)
PANG JIAN (CN)
SUN TUOBEI (CN)
PANG JIAN (CN)
SUN TUOBEI (CN)
Application Number:
PCT/CN2022/081981
Publication Date:
December 15, 2022
Filing Date:
March 21, 2022
Export Citation:
Assignee:
SANECHIPS TECH CO LTD (CN)
International Classes:
H01L25/18; H01L23/367; H01L23/498
Domestic Patent References:
| WO2005081310A1 | 2005-09-01 |
Foreign References:
| CN214753761U | 2021-11-16 | |||
| US20080042263A1 | 2008-02-21 | |||
| US20100309628A1 | 2010-12-09 | |||
| US5949137A | 1999-09-07 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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