Title:
CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/027278
Kind Code:
A1
Abstract:
Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer, without using a separate insulating layer formed on the molding layer as in the conventional art.
Inventors:
KWON YONG TAE (KR)
LEE EUNG JU (KR)
YEO YONG WOON (KR)
PARK YUN MOOK (KR)
KIM HYO YOUNG (KR)
LEE JUN KYU (KR)
CHEON SEOK HWI (KR)
LEE EUNG JU (KR)
YEO YONG WOON (KR)
PARK YUN MOOK (KR)
KIM HYO YOUNG (KR)
LEE JUN KYU (KR)
CHEON SEOK HWI (KR)
Application Number:
PCT/KR2018/008816
Publication Date:
February 07, 2019
Filing Date:
August 03, 2018
Export Citation:
Assignee:
NEPES CO LTD (KR)
International Classes:
H01L23/28; H01L21/56; H01L23/00; H01L23/48; H01L23/485; H01L23/498; H01L23/528; H01L25/07
Foreign References:
KR20160039752A | 2016-04-12 | |||
KR20110123297A | 2011-11-15 | |||
KR20130129100A | 2013-11-27 | |||
US20110316150A1 | 2011-12-29 | |||
KR20160083977A | 2016-07-13 |
Attorney, Agent or Firm:
E-SANG PATENT & TRADEMARK LAW FIRM (KR)
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