CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR

Title:

CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2019/027278

Kind Code:

A1

Abstract:

Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer, without using a separate insulating layer formed on the molding layer as in the conventional art.

Inventors:

KWON YONG TAE (KR)
LEE EUNG JU (KR)
YEO YONG WOON (KR)
PARK YUN MOOK (KR)
KIM HYO YOUNG (KR)
LEE JUN KYU (KR)
CHEON SEOK HWI (KR)

Application Number:

PCT/KR2018/008816

Publication Date:

February 07, 2019

Filing Date:

August 03, 2018

Export Citation:

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Assignee:

NEPES CO LTD (KR)

International Classes:

H01L23/28; H01L21/56; H01L23/00; H01L23/48; H01L23/485; H01L23/498; H01L23/528; H01L25/07

Foreign References:

KR20160039752A	2016-04-12
KR20110123297A	2011-11-15
KR20130129100A	2013-11-27
US20110316150A1	2011-12-29
KR20160083977A	2016-07-13

Attorney, Agent or Firm:

E-SANG PATENT & TRADEMARK LAW FIRM (KR)

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