Title:
CHIP PACKAGE STRUCTURE, CHIP MODULE, AND ELECTRONIC TERMINAL
Document Type and Number:
WIPO Patent Application WO/2019/014883
Kind Code:
A1
Abstract:
Provided are a chip package structure, a chip module, and an electronic terminal. In the chip package structure, a chip (2) is placed in a recess of a substrate (1) to reduce a thickness and a size of the chip package structure. Moreover, a plastic sealant (3) is applied to a surface of the substrate in which the chip is placed to plastic-seal the chip, thereby enhancing structural strength of the chip package structure while minimizing warps which are likely to form due to a reduction in the thickness of the chip package structure. In addition, the plastic sealant is processed to have a flat surface, such that a chip module has favorable smoothness and enhanced adaptability.
Inventors:
ZHANG SHENGBIN (CN)
LIU KAI (CN)
LIU KAI (CN)
Application Number:
PCT/CN2017/093612
Publication Date:
January 24, 2019
Filing Date:
July 20, 2017
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L21/48
Foreign References:
| CN106531711A | 2017-03-22 | |||
| CN106601628A | 2017-04-26 | |||
| CN106409690A | 2017-02-15 | |||
| CN103325757A | 2013-09-25 |
Other References:
See also references of EP 3454363A4
Attorney, Agent or Firm:
BEIJING HEADSTAY INTELLECTUAL PROPERTY AGENCY (CN)
Download PDF: