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Patent Searching and Data


Title:
CHIP PACKAGING STRUCTURE, CAMERA MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/272450
Kind Code:
A1
Abstract:
A chip packaging structure, a camera module, and an electronic device, the chip packaging structure comprising a chip (10), a substrate (20), a plurality of gold fingers (30), and a first gold wire (41), the chip (10) being mounted on the substrate (20), the plurality of gold fingers (30) being spaced apart on the substrate (20) and positioned on at least one side of the chip (10), the first gold wire (41) comprising a first connecting part (411) and a second connecting part (412) facing away from one another and a middle part (413) positioned between the first connecting part (411) and the second connecting part (412), the first connecting part (411) being connected to a gold finger (30), the second connecting part (412) being connected to another gold finger (30), and the middle part (413) being arched in the direction away from the substrate (20). By means of employing the wiring method of connecting two different gold fingers (30) with a gold wire, when connecting lines need to be arranged in a crossed manner, the first gold wire (41) can cross over a lead wire disposed on the surface of the substrate (20) without the need to drill holes, saving wiring space and helping to reduce the size of the circuit board; in addition, by means of reducing the number of drilling holes, the thickness of the circuit board can be reduced, realising miniaturisation and thinning of the module.

Inventors:
LIU YANNI (CN)
Application Number:
PCT/CN2021/102831
Publication Date:
January 05, 2023
Filing Date:
June 28, 2021
Export Citation:
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Assignee:
OFILM GROUP CO LTD (CN)
JIANGXI JINGHAO OPTICAL CO LTD (CN)
International Classes:
H01L23/49; H01L27/146
Foreign References:
CN103347364A2013-10-09
CN101740540A2010-06-16
CN1624905A2005-06-08
CN101937886A2011-01-05
CN102254839A2011-11-23
US20050224964A12005-10-13
US20100127362A12010-05-27
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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