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Title:
CHIP PACKAGING STRUCTURE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/136069
Kind Code:
A1
Abstract:
Provided is a chip packaging structure, comprising at least one chip packaging unit; the chip packaging unit comprises: a flexible substrate (2) and a rigid substrate (1); the flexible substrate (2) comprises a first flexible substrate (20), and a plurality of input pins (22) and a plurality of output pins (21) arranged on the first flexible substrate (20), the input pins (22) and the output pins (21) being connected in one-to-one correspondence; the rigid substrate (1) comprises a rigid base substrate (10) and a chip (11) arranged on the rigid base substrate (10); the rigid substrate (1) is bound with a drive circuit board (4) of a display device; the two opposite sides of the flexible substrate (2) are respectively bound with the rigid substrate (1) and a display panel (3) of the display device; the plurality of input pins (22) are electrically connected to the chip, and the plurality of output pins (21) are used for transmitting signals to the display panel (3).

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Inventors:
DING PENG (CN)
FANG ZHIXIANG (CN)
YANG GUANGLEI (CN)
WANG MENG (CN)
HU XUXU (CN)
Application Number:
PCT/CN2020/139093
Publication Date:
July 08, 2021
Filing Date:
December 24, 2020
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI BOE OPTOELECTRONICS TECH (CN)
International Classes:
G09F9/30; G02F1/1345; G09F9/35; H01L51/52
Foreign References:
CN110286535A2019-09-27
CN106647069A2017-05-10
CN106773204A2017-05-31
CN110111684A2019-08-09
CN110164901A2019-08-23
CN106255310A2016-12-21
CN110323252A2019-10-11
KR100932981B12009-12-21
CN107450777A2017-12-08
CN108803103A2018-11-13
CN110164874A2019-08-23
CN106896960A2017-06-27
CN108803164A2018-11-13
CN111179755A2020-05-19
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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