Title:
CHIP PACKAGING STRUCTURE, FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/019558
Kind Code:
A1
Abstract:
The present application provides a chip packaging structure, a fabrication method therefor, and an electronic device. The chip packaging structure comprises: a re-distribution layer (RDL), a plastic packaging structure in which at least two dies are wrapped, and a support carrier plate. The plastic packaging structure is fixed on the RDL, and the support carrier plate is fixed on one side of the plastic packaging structure facing away from the RDL. The support carrier plate comprises a non-metal material, and the support carrier plate is rigidly connected to each die in the plastic packaging structure. The support carrier plate is made of the non-metal material, and thus the support carrier plate can match with a bonding layer that has strong rigidity and that is not affected by temperature to achieve rigid connection with the dies. As such, during a plastic packaging process, the dies can withstand the fluid pressure of the plastic packaging material, reducing the shift of the dies, and reducing the process difficulty of the chip packaging structure. After the chip packaging structure is fabricated, the support carrier plate is retained inside of the chip packaging structure. Since the support carrier plate has a structural support effect on the dies, the reliability of the chip packaging structure can be improved.
Inventors:
CHIANG SHANGHSUAN (CN)
ZHAO NAN (CN)
ZHAO NAN (CN)
Application Number:
PCT/CN2021/113802
Publication Date:
February 23, 2023
Filing Date:
August 20, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/31
Foreign References:
| CN109860126A | 2019-06-07 | |||
| CN106684006A | 2017-05-17 | |||
| CN111370395A | 2020-07-03 | |||
| CN111370329A | 2020-07-03 | |||
| CN111200701A | 2020-05-26 | |||
| US20210134704A1 | 2021-05-06 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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