Title:
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/121162
Kind Code:
A1
Abstract:
A chip packaging structure (10) comprising a substrate (104), multiple chips (101 and 102) and multiple discrete components (103) packaged on the upper surface of the substrate, and a heat-dissipating apparatus (100). The heat-dissipating apparatus comprises an insulating layer (106) and a thermally-conductive layer (107) in a laminated arrangement. The insulating layer completely covers and fits the multiple chips, the outer surfaces of the multiple discrete components, and the upper surface of the substrate, and is used for transferring heat produced by the multiple chips and the multiple discrete components to the thermally-conductive layer and the substrate, thus dissipating via the thermally-conductive layer and the substrate the heat produced by the multiple chips and the multiple discrete components. A manufacturing method for the chip packaging structure. By means of the heat-dissipating apparatus provided, the chip packaging structure is capable of implementing even and efficient heat dissipation for a system-in-package.
Inventors:
FU HUILI (CN)
CAI SHUJIE (CN)
HU XIAO (CN)
CAI SHUJIE (CN)
HU XIAO (CN)
Application Number:
PCT/CN2017/113385
Publication Date:
July 05, 2018
Filing Date:
November 28, 2017
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/367; H01L21/50; H01L23/373
Foreign References:
CN106684057A | 2017-05-17 | |||
CN103681543A | 2014-03-26 | |||
CN102692000A | 2012-09-26 | |||
US20010019181A1 | 2001-09-06 | |||
US20020050407A1 | 2002-05-02 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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