Title:
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/000179
Kind Code:
A1
Abstract:
The present application provides a chip packaging structure and a chip packaging method. The chip packaging structure comprises a chip 11 and a plastic packaging material 12 that completely encloses the chip. The chip 11 is provided with a conductor post 111. The conductor post 111 passes through the plastic packaging material. A first end of the conductor post 111 is coupled to an internal circuit of the chip 11, and a second end of the conductor post 111 is used for coupling the chip 11 to an external circuit. Thus, the chip packaging structure completely encloses the chip 11 by means of the plastic packaging material 12, and can balance stresses between the chip 11 and the plastic packaging material 12 in all directions while protecting the surfaces of the chip 11, thereby avoiding the problems of cracking, chipping, etc. of the chip 11 caused by an excessively large stress on the chip 11 in a certain direction, improving the long-term reliability of the chip packaging structure.
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Inventors:
SHEN ZHONGGUO (CN)
Application Number:
PCT/CN2018/092861
Publication Date:
January 02, 2020
Filing Date:
June 26, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/60; H01L21/48; H01L21/56; H01L23/495
Foreign References:
| CN104217969A | 2014-12-17 | |||
| CN103390563A | 2013-11-13 | |||
| CN103021984A | 2013-04-03 | |||
| CN102403275A | 2012-04-04 | |||
| US6847109B2 | 2005-01-25 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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