Title:
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/178671
Kind Code:
A1
Abstract:
The present disclosure provides a chip packaging structure and a chip packaging method. The structure comprises: a sample substrate, provided with a plurality of through holes passing through the sample substrate in the thickness direction; a first cover plate and a second cover plate, respectively located on the two opposite sides of the sample substrate in the thickness direction of the substrate and attached to the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair being located on one of the first cover plate and the second cover plate or located respectively on the first cover plate and the second cover plate. A circulation path is formed between each pair of the sample inlet and the sample outlet. The surface of the first cover plate opposite to the sample substrate is provide with a first flow channel structure, and the surface of the second cover plate opposite to the sample substrate is provided with a second flow channel structure. The first flow channel structure and the second flow channel structure connect the plurality of through holes to form a continuous channel corresponding to the circulation path between each pair of the sample inlet and the sample outlet. The chip packaging structure and the chip packaging method provided by the present disclosure can solve the problems of insufficient filling of micropores with a sample, bubbles in the micropores and the like.
Inventors:
MA XIANGGUO (CN)
LIU ZHUKAI (CN)
DING DING (CN)
DENG LIN (CN)
LIU ZHUKAI (CN)
DING DING (CN)
DENG LIN (CN)
Application Number:
PCT/CN2022/083122
Publication Date:
September 28, 2023
Filing Date:
March 25, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
International Classes:
B01L3/00; B01D19/00
Foreign References:
| CN113145189A | 2021-07-23 | |||
| US20090179146A1 | 2009-07-16 | |||
| CN103667057A | 2014-03-26 | |||
| CN207850932U | 2018-09-11 | |||
| CN112934277A | 2021-06-11 | |||
| CN112371195A | 2021-02-19 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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