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Title:
CHIP PACKAGING STRUCTURE AND PHOTOELECTRIC APPARATUS COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/246474
Kind Code:
A1
Abstract:
Disclosed in the present application are a chip packaging structure and a photoelectric apparatus comprising same. The chip packaging structure comprises: a CPO module (100), an electrical connector, and a photoelectric compensation chip (300), wherein the electrical connector is connected to the CPO module (100), the photoelectric compensation chip (300) is electrically connected to the CPO module (100) by means of the electrical connector, and the photoelectric compensation chip (300) is detachably connected to the electrical connector.

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Inventors:
DUAN MINGHUI (CN)
Application Number:
PCT/CN2023/098079
Publication Date:
December 28, 2023
Filing Date:
June 02, 2023
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H01L25/16; H01L23/31; H04L12/02
Foreign References:
CN114371537A2022-04-19
US7470069B12008-12-30
CN114337827A2022-04-12
CN216700004U2022-06-07
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
Download PDF:
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